Used PETER WOLTERS / LAPMASTER microLine AC 2000-P2 #9352424 for sale
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ID: 9352424
Wafer Size: 12"
Vintage: 2007
Double side polishing machine, 12"
Wheel dimensions:
Outer: 1935 mm
Ring width: 686 mm
Thickness: 80 mm
Wheel distance: 190 mm With 80 mm wheel thickness
Pneumatic:
Maximum load pressure: 3500 daN
Compressed air: 6,5 Bar
Electronic equipment:
Servo drives digitally controller
Upper wheel: 46 kW/40 min⁻¹
Lower wheel: 46 kW/40 min⁻¹
Inner workpiece drive: 7,5 kW/min⁻¹
Outer workpiece drive: 7,5 kW/min⁻¹
Hold the drive aggregates for lower working wheel and workpiece drive
Electromechanical height adjustment for outer and inner pin ring
Splash guard pan
Assembly connections for easy access
Pneumatic load control
Interception device
Weighting device
Drives
Working wheels
Safety device
Corrosion resistant design
Electric switch cabinet (Air cooled)
CNC Controller
Operating panel
Polishing media connection and metering
Slurry distribution system
Polishing media collecting channel
Tool kit
Basical range of CNC control S7-400 with visualization
Pressure control via proportional valve and pressure sensor
Display of the actual pressure value
13-Pressure ranges
Variable speed of rotation change in each pressure range of each drive
Variable change of rotation direction
Automatic swiveling in / out
5-Conditioning program with recorded inception height
Alternative list for selective programming functions:
Swiveling device
Starting of the drives
Feeding of the polishing media
Wet mode
0020: Brush program
0030: Cooling water temperature monitoring
0040: Rinsing and spraying device (Chemical polishing)
0050: Spraying device
0060: Levelling device for horizontal adjustment of the upper working wheel
0070: Epicyclic work holder drive system
0080: (2) Polishing wheels
0090: Back up
Options:
0100: Power backup
0110: Polishing compound connection
0120: Cable identification
0130: Mixing block
0140: Taiwan electrics
Electrics: 460 V
UPS: 230 V
0150: Packing
0160: Commissioning
0170: Status light
0180: Loading counter
0190: Second hand operation station
0200: Shower guns for DI- Water
0210: (2) Heating / Cooling aggregate (WRK) 12760 W
0220: Heating / Cooling aggregate Heating possibility up to 55°C
0230: Fittings for cooling water circulation system with refrigeration unit
0240: 6-Step polishing program
0260: Fiberglas cable
0270: Separate drive security
0290: Signal tower with LED
0300: Indication of signal tower
0310: Upgrades
0320: 80-Polishing feed holes
0330: Anti-syphoning package
0340: Measuring device (Flatness)
0350: Distance block set
0360: Steel straight edge, 2000-0 mm
0370: Additional cable length
0380: Engineering costs
0390: PDR System
Power supply: 400 V + 6%-10% (Acc. DIN IEC 38)
Frequency: 50 Hz
Control voltage: 203 V / 24 VDC
2007 vintage.
PETER WOLTERS / LAPMASTER microLine AC 2000-P2 is an advanced wafer grinding, lapping and polishing equipment for multi-sided, fully automated wafer processing. It provides highly accurate and uniform fabrication of large and small wafers up to 200 mm in size. The system features an advanced computer-controlled robot loading and orientation unit. This machine is designed to precisely and consistently place wafers in precise positions on grinding and polishing rolls. The high-precision grinding/polishing grinding rollers are mounted in a rotating chuck for precise angular adjustments, allowing for very fine grinding and polishing of wafers. The tool uses precision diamond grinding abrasives for polishing wafers to the highest possible tolerances. It provides an excellent surface finish and accuracy for both flat and curved surfaces. The mechanical grinding process combined with the computer-controlled asset ensure repeatable results. The model also features an advanced wafer mapping equipment to ensure consistent, precise results. The wafer mapping system uses precision laser sensors and a 3D laser scanner. The laser scanner collects data points off of the wafers to create a detailed topographical map of the wafer's surface. This data is fed into the robot unit to accurately position and secure the wafer for grinding and polishing. LAPMASTER microLine AC 2000-P2 also features an advanced post-processing machine. This tool automatically collects and stores data points from the final grinding and polishing process to ensure repeatable results. The post-processing asset also removes any burrs, dents or other imperfections from the finished wafer. PETER WOLTERS microLine AC 2000-P2 is designed for long through-put runs and is easily integrated into existing wafer processing systems. It is capable of handling wafers up to 200mm in diameter and providing superior results in wafer grinding, lapping and polishing operations.
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