Used PETER WOLTERS / LAPMASTER microLine AC 2000-P2 #9352425 for sale
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ID: 9352425
Wafer Size: 12"
Vintage: 2007
Double side polishing machine, 12"
Wheel dimensions:
Outer: 1935 mm
Ring width: 686 mm
Thickness: 80 mm
Wheel distance: 190 mm With 80 mm wheel thickness
Pneumatic:
Maximum load pressure: 3500 daN
Compressed air: 6,5 Bar
Electronic equipment:
Servo drives digitally controller
Upper wheel: 46 kW/40 min⁻¹
Lower wheel: 46 kW/40 min⁻¹
Inner workpiece drive: 7,5 kW/min⁻¹
Outer workpiece drive: 7,5 kW/min⁻¹
Hold the drive aggregates for lower working wheel and workpiece drive
Electromechanical height adjustment for outer and inner pin ring
Splash guard pan
Assembly connections for easy access
Pneumatic load control
Interception device
Weighting device
Drives
Working wheels
Safety device
Corrosion resistant design
Electric switch cabinet (Air cooled)
CNC Controller
Operating panel
Polishing media connection and metering
Slurry distribution system
Polishing media collecting channel
Tool kit
Basical range of CNC Control S7-400 With visualization
Pressure control via proportional valve and pressure sensor
Display of the actual pressure value
13-Pressure ranges
Variable speed of rotation change in each pressure range of each drive
Variable change of rotation direction
Automatic swiveling in / out
5-Conditioning program with recorded inception heights
Alternative list for selective programming functions:
Swiveling device
Starting of the drives
Feeding of the polishing media
Wet mode
0020: Brush program
0030: Cooling water temperature monitoring
0040: Rinsing and spraying device (Chemical polishing)
0050: Spraying device
0060: Levelling device for horizontal adjustment of the upper working wheel
0070: Epicyclic work holder drive system
0080: (2) Polishing wheels
0090: Back up
Options:
0100: Power backup
0110: Polishing compound connection
0120: Cable identification
0130: Mixing block
0140: Taiwan electrics
Electrics: 460 V
UPS: 230 V
0150: Packing
0160: Commissioning
0170: Status light
0180: Loading counter
0190: Second hand operation station
0200: Shower guns for DI- Water
0210: (2) Heating / Cooling aggregate (WRK) 12760 W
0220: Heating / Cooling aggregate Heating possibility up to 55°C
0230: Fittings for cooling water circulation system with refrigeration unit
0240: 6-Step polishing program
0260: Fiberglas cable
0270: Separate drive security
0290: Signal tower with LED
0300: Indication of signal tower
0310: Upgrades
0320: 80-Polishing feed holes
0330: Anti-syphoning package
0340: Measuring device (Flatness)
0350: Distance block set
0360: Steel straight edge, 2000-0 mm
0370: Additional cable length
0380: Engineering costs
0390: PDR System
Power supply: 400 V + 6%-10% (Acc. DIN IEC 38)
Frequency: 50 Hz
Control voltage: 203 V / 24 VDC
2007 vintage.
LAPMASTER AC 2000-P2 is a wafer grinding, lapping, and polishing equipment for semiconductor wafers. It is a precision instrument with a computerized controller, a modular error-free spindle drive, and a wide range of high-quality abrasive materials and quick-change-over mounted on an industrial grade granite base. The system is designed to handle 200-300 mm wafer lapping and grinding with the highest accuracy and repeatability. The AC 2000-P2 features a two-stage lapping and polishing process. Each stage is divided into two parts: the first stage consists of a mounting station, a wafer clamping plate, and a robust lapping wheel. The second stage uses a different lapping wheel and features a polishing pad holder and a coarse-to-fine progression of abrasive agents. Both stages include a variable speed adjustment, allowing the operator to increase or decrease the speed as needed. The AC 2000-P2 also features a computerized controller, which provides the operator with detailed data, including run time, process settings, automatic shutoff, and machine status indicators. The controller is extremely flexible and can accept a wide range of input choice options, such as manual, semi-automatic and fully automatic mode. The unit also offers adjustable parameters like pressure, slip, and vibration limit regulation to ensure the highest process accuracy. The machine also has an integrated dust removal tool. Air blades sweep away generated abrasive dust while disposing it external to the machine. The dust collection meshes also have adjustable settings to meet the most stringent particle requirements. PETER WOLTERS AC 2000-P2 is equipped with a modular error-free spindle drive that offers high-precision operation. This sophisticated design, combined with the principles of ergonomics and AC motor technology, provides a reliable and safe operation. The asset also includes a variety of optional modules, such as an air-unit for wafer clamping and overpressure-control, as well as a high-accuracy vibration protection model. These features make PETER WOLTERS / LAPMASTER AC 2000-P2 an ideal machine for the mass production of high-precision wafers. Its precision engineering and flexibility offer a true 'all-in-one' equipment, capable of lapping, polishing, air-blowing, and any other refinements required in the production process. The system's controller gives the operator full control over the process, allowing for superior process quality. The AC 2000-P2 is an ideal choice for producers looking for a reliable unit for the manufacturing of semiconductor wafers.
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