Used SANWA DAIYA (Wafer Grinding, Lapping & Polishing) for sale

Sanwa Daiya is a leading manufacturer of wafer grinding, lapping, and polishing equipment, offering a wide range of advanced equipment for semiconductor manufacturing. The company specializes in providing high-precision solutions that meet the demanding needs of the industry. One of Sanwa Daiya's notable systems is the BM-05NC, a wafer grinding machine that combines high throughput and accuracy. With its CNC control, this system ensures precise grinding of wafers, resulting in excellent surface quality. The BM-2000 is another popular model, designed for heavy-duty applications with its robust construction and large grinding area. Sanwa Daiya's lapping and polishing units are highly regarded for their efficiency and accuracy. These machines are capable of achieving tight flatness tolerances and excellent surface finishes, crucial for semiconductor production. The Hiji line of equipment, including the HJ-1000 and HJ-2000 models, are well-known for their versatility and ability to handle various types of wafers. Advantages of Sanwa Daiya tools include their advanced automation features, such as automatic loading/unloading and process monitoring. The machines are designed for easy operation and maintenance, ensuring minimal downtime. Sanwa Daiya's assets also offer excellent process repeatability, resulting in consistent product quality. Overall, Sanwa Daiya's wafer grinding, lapping, and polishing models are trusted in the semiconductor industry for their precision, reliability, and productivity. These equipment have proven to be valuable assets for manufacturers, enabling them to meet strict requirements and achieve high-quality semiconductor products.