Used SHIMADZU HMV-2T #9010414 for sale

SHIMADZU HMV-2T is a wafer grinding, lapping and polishing equipment designed to ensure high-precision surface finish. It performs the operations of grinding, lapping and polishing, which are vital steps of wafer production. The system is specifically designed to deal with semiconductor wafers made of hard materials such as SiC, Si and GaAs. HMV-2T unit consists of three parts: the Control Unit, Grinding and Polishing Platen, and Grinding and Polishing Head. The Control Unit houses the servomotor that determines the speed of rotation for the Platen and polisher, as well as a pressure regulator that ensures a specific grinding and polishing force. In addition, an advanced vision machine provides real-time monitoring of polishing and grinding operations which facilitates precise control over the tool. The Platen, which is made of a patented, special heat-treatable material, ensures excellent flatness and thermal stability. Its surface is designed to reduce possibility of particle contamination and ensure a perfectly flat surface finish. The Grinding and Polishing Head, loaded with grinding and polishing cloths, rotates at high speed against the surface of the Platen and the workpiece in order to achieve a precisely finished wafer surface. SHIMADZU HMV-2T asset also features a comprehensive and intuitive software package that simplifies the setup and operation of the model. It allows users to control the equipment's process parameters, adjust the grinding and polishing pressure, and monitor the grinding and polishing result in real time. HMV-2T system is designed to provide a high-precision surface finish for difficult material and is suitable for a wide range of wafer fabrication applications. Its extra-rigid design ensures minimal vibration and hence superior performance for high-accuracy applications. It is a high-end unit that is designed to provide consistent surface finish and reliability.