Used SPEEDFAM 15B #9380963 for sale

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ID: 9380963
Vintage: 1989
Double side lapping machine Masterflex peristaltic pump 3M Trizact diamond pad Down force range: 0-303 kg Crosscut spacing width: 30 x 40 x 2 mm Upper plate: 303 kg Lower plate: 5-65 RPM (5) Carriers Lifting cylinder: φ 140 mm x 290 Stroke Pressure control cylinder: φ 140 mm x 80 Stroke Slurry pump: 0.4 kW Main drive motor: 7.5 kW Sun gear drive motor: 1.5 kW Air supply: 5-6 kg/cm², 20 Liter/min Carrier / Ring gear / Sun gear: M: 3 / 3 / 3 Z: 128 / 356 / 100 PCD: 384 / 1068 / 300 Maximum diameter: φ 310 mm Minimum thickness: 0.35 mm Maximum thickness: 30 mm Maximum down force: 303 kg Lower plate: 50/60 Hz Power: 50 A, 100-480 V, 3-Phase, 7.9-9.4 kW 1989 vintage.
SPEEDFAM 15B Wafer Grinding, Lapping, and Polishing Equipment is a state-of-the-art semiconductor polishing machine with an efficient workflow, precise control, and unmatched repeatability. This system is designed for applications ranging from 200mm wafers to 2-inch and 25mm substrates or even smaller, enabling single-wafer polishing of the workpiece. 15B features a multi-axis robotic pick-and-place unit, a precision linear scale with a positioning accuracy of 0.5 microns, and a segmented fine-tuning control machine. The multi-axis tool provides a full range of motion, allowing the operator to accurately position and control the workpiece as it is processed. The precision linear scale ensures that the workpiece is in the desired position throughout the operation and the segmented fine-tuning asset allows for continuous adjustment of the surface to achieve the desired result with greater accuracy. SPEEDFAM 15B utilizes a flat surface platen to support the workpiece during grinding and polishing operations. This platen is specially designed for uniform pressure, abrading, and workpiece-to-platen surface contact during the grinding/polishing process. In addition, the platen has an adjustable height option for workpieces of varying heights or uneven surfaces. 15B is designed for low-abrasion polishing, resulting in a greater surface finish accuracy. The polishing process is carefully managed by a programmable model which precisely controls the spindle speeds, rotation, and platen pressure for each polishing step. As a result, the polishing process is completed in a fraction of the time needed with traditional processes. SPEEDFAM 15B also utilizes a fully programmable wafer inspection station which allows for real-time monitoring and control of the wafers and surface finish quality. This allows the operator to ensure that the wafer is in good condition throughout the entire process. 15B is a sophisticated wafer grinding, lapping, and polishing equipment that is capable of producing high-quality workpieces with excellent surface finish accuracy. With its advanced controls, SPEEDFAM 15B ensures fast and consistent wafer processing, and has proven itself to be a reliable and efficient system.
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