Used SPEEDFAM 9B-5L #293586267 for sale

SPEEDFAM 9B-5L is a state-of-the-art wafer grinding, lapping & polishing equipment designed to meet the requirements of the semiconductor industry. This system is capable of grinding, lapping and polishing wafers at high speed and with extreme precision. The unit includes a 9-axis motion control for rapid direction changes and accurate positioning of the wafer, as well as an integrated CNC control for precise control of the lapping and polishing process. SPEEDFAM 9B5L also features a precision engineered range of lapping and polishing platen attachment units that enable a wide variety of processing techniques. The control machine provides the user with full flexibility in setting the desired processing parameters such as the pressure, speed and angle of the platens. 9 B-5 L is suitable for a wide range of wafer processing applications. The tool is capable of grinding both single- and multiple-side wafers with a maximum size of 200mm/8". The platen attachment units can be utilized for both lapping and polishing, utilizing different polishing heads for type of surface finish required. The asset is particularly well-suited for processing wafers with irregular shapes or glass-ceramic composite wafers due to its ability to customize the pressure, speed and angle accordingly. 9 B 5 L is equipped with advanced protective features to ensure operator safety. The model is equipped with interlocks which prevent accidental operation or access to the equipment in the case of a hazard being detected. The system also features a laser scanner which identifies and stops the motion of any foreign object that comes close to the unit and prevents any damage to the machine or wafer. Additionally, the machine is protected against excess temperature thanks to a thermal safety device and comes with a protective enclosure to help minimize any potential contamination. SPEEDFAM 9 B 5 L is a versatile and high-performance tool that can be used for both batch and inline processing of semiconductor wafers. With its advanced motion control, comprehensive range of lapping and polishing units and advanced safety features, this asset is an ideal choice for any semiconductor wafer grinding, lapping and polishing application.