Used STRASBAUGH 6DA-DC-1 #9250805 for sale

STRASBAUGH 6DA-DC-1 is a high-end wafer grinding, lapping, and polishing equipment designed for precision semiconductor processes. The system is manufactured by STRASBAUGH Corporation, a 70-year-old company specializing in polishing products. 6DA-DC-1 is part of the company's 6DA series and is engineered for superior process control and reliability, allowing users to achieve tight control limits including high precision, flatness, thickness, roughness, and surface finish. The unit comes with a motor-driven grinding/lapping platen and a vacuum table for both wafer handling and dust removal. The grinding/lapping platen features a 1" thick aluminum substrate and coated surface, designed to provide uniformly distributed and stable grinding pressure, even at high rotational speeds. The vacuum table consists of a diaphragm pump for vacuuming and a convenient computerized touchpad for changing process settings. STRASBAUGH 6DA-DC-1 also features a variable speed drive machine for infinitely adjustable power levels, allowing users to fine-tune grinding and polishing processes. For further process flexibility, the tool is equipped with customizable discs for a variety of metallurgical operations. Alternators of variable speed for 1000-8000 rpm are available as a factory-installed option. 6DA-DC-1 is designed for 100% assurance production with built-in process control features, including online data logging and reporting, auto-calibration of mechanical and electrical parts, and self-monitoring sensors to alert the user of any process issues. Other features of STRASBAUGH 6DA-DC-1 include: * Easy-to-install modularity for easy integration in a production line * Personnel-monitoring stations * Self-contained air conditioning/filtration asset for improved operator-safety and environmental compliance * Fully CNC-controllable for flexibility and reproducibility of grinding/lapping operations * Low noise emission and low-vibration levels 6DA-DC-1 is designed for use in production facilities requiring precise process control and is suitable for grinding a wide range of substrates, including both hard and soft materials such as silicon, sapphire, etc. The model is highly recommended for applications demanding higher-precision grinding, lapping, and polishing tasks.