Used RECIF SPP300 #9282526 for sale

RECIF SPP300 is a semiconductor-grade wafer handler capable of automatically loading and unloading cassettes with wafer fixtures, while protecting them from environmental contamination. This device allows for precise placement of a wafer in a specified holder and its subsequent transfer to the next location. Equipped with an automated vision sensor, the handler has the capability to perform top-side and back-side wafer inspections. SPP300 is comprised of two separate integrated modules: the Wafer Handling Module (WHM) and the Process Control Module (PCM). The WHM consists of a robotic arm that is capable of performing pick-up and placement operations as well as a drive mechanism for achieving motion. This module also contains an integrated vision system, allowing for seamless inspection and retrieval of wafer information. The PCM is responsible for controlling and monitoring all robotic movements and process steps. It includes a Computer Numerical Control (CNC) command language, expandable memory space, and a user-friendly interface for programming automation processes. This device offers a wide range of features, allowing it to be used for a variety of applications. Its high positioning accuracy and force control enhances overall wafer performance. RECIF SPP300 also offers integrated safety features such as non-contact sensors that monitor movements of the wafer and process steps. This automated wafer handler is equipped with a clamp device that secures the semi wafer for alignment in the robotic arm and guarantees the wafer's stability during transfer to its destined site. The device can be used in temperature-controlled environments and offers a user-friendly Human-Machine Interface (HMI). SPP300 wafer handler is suitable for a variety of usage including the semiconductor, LED, and MEMS industries, and provides increased productivity and cost savings. It is powered by an integrated vacuum system as well as an integrated pressure system. This efficient device offers reliable performance and an improved wafer yield.