Used CANON MPA 600 FA #9060105 for sale
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ID: 9060105
Projection aligner, 6"
Slit: 1.6mm
Includes:
Illumination power check meter, 7”
Focus tilt mask, 7”
DR Mask
Projection system:
Projection mirror:
Total reflection UM02
Magnification: 1x
Image size:
Stationary: Arcuate image 150 mm (L) x 1.6 to 2.0 mm (W), with radius of 95 mm
Scanning: Φ6 (150 mm) Over entire surface, excluding that under (3) disk claws
Magnification: 1x
Effective F number: Fe 3.5
Wavelengths used:
Printing (UV): 365 nm (i-line), 405 nm (h-line) & 436 nm (g-line)
Manual alignment: E-line (546 nm) & orange light
Auto alignment: 633 nm (He-Ne Gas laser)
Illuminator:
Light source:
USHIO ELECTRIC USHY-2002MA 2 kW Super-high-pressure mercury lamp
Illumination range:
Length: 150 mm
Width: 1.6 to 2.0 mm
Radius: 95 mm
Illumination uniformity: Within ±3%
Effective light source: σ = 0.7, σ = 0.6, σ = 0.5
Exposure:
Scanning speed: Φ5" (Φ125 mm)
Setting range: 5.0 - 150.0 sec (for 5" wafer)
Setting units: Uniform 0.1 sec increments
Scanning mechanism:
Feed / Control methods
Closed loop method with DC servo motor drive
Scanning speed: 5.0 to 150.0 sec (25 mm/sec-0.83 mm/sec) for 5" wafer
Carriage position setting:
Setting range: -75 mm to 75 mm
Increment: 0.01 mm
Setting accuracy: ±10 /µm
Alignment scope:
Objective lens: 10x, NA 0.2
Eyepiece: 10x, 15x
Erector lens: 1x, 2x, 3x
Low-magnification lens: 0.3x
Distance between objective lenses:
30 to 109.6 mm (Traveling simultaneously on both sides of center position)
Setting range of objective lens distance: 30.00 to 109.6 mm in 0.02 mm increments
Focusing travel (both fields of view): ±2 mm
Auto alignment:
Laser beam scanning
Light source: He-Ne Gas laser (633 nm), polarized type 5 mW
Dedicated patterns are used for auto alignment
Offset control: Read/write possible in range of 0 to 7.9 /µm
Tolerance setting: 0.25 (0.15) /µm, 0.5µm, 1 µm
Auto alignment time: Within 7 sec
Observation in auto alignment mode possible
Auto feeder:
Auto/manual switching: Automatic / Manual wafer feed selectable
Feed method: Belt & auto hand
Wafer size: 4"-6"
Applicable carrier: FLUOROWARE Type carrier: Standard
Capacity: 25 wafers
Pitch: 3/16"
Projection system focusing:
Focus adjustment: ±1.5 mm
Travel amount obtained by one rotation of knob: 10 µm
Power supply:
MPA-600FA: 200 VAC, 3Φ, 6 kVA, 50/60 Hz
Air supply unit: 200 VAC, 3Φ, 8 kVA, 50/60 Hz.
CANON MPA 600 FA is a high-precision mask aligner developed by CANON for wafer-level packaging. It is a full-featured instrument that offers a wide array of features and capabilities, making it ideal for use in a wide range of device manufacturing applications. CANON MPA600FA utilizes a high-resolution projection alignment equipment which uses infrared light to precisely project and align the mask pattern onto the wafer surface. This system allows for fine position adjustments and facilitates accurate and repeatable alignment of the mask pattern onto the wafer surface. MPA-600FA is also equipped with a high-power laser annealing unit, allowing users to thermally treat selected areas of the wafer for a variety of purposes. This machine is capable of producing uniform heat across the entire wafer, ensuring uniform surface formation and preventing device failure due to temperature-related issues. MPA 600 FA is equipped with a custom-designed metal mask holder that enables users to accurately position and attach the metal mask to the wafer during alignment. It also features an automated Optical Stepper, which greatly increases the speed and precision of the alignment process. CANON MPA 600FA also includes an automated control tool that allows for easy operation and management of the instrument. This asset includes a user-friendly graphical interface, allowing users to perform various operations, such as selecting parameters or controlling masks, without any prior training. CANON MPA-600 FA also offers a variety of safety features to protect both the user and the device, including an automatic shut-off model in case of abnormal operation and a built-in dust filter to prevent dust and debris from entering the instrument. CANON MPA-600FA is an excellent choice for semiconductor device manufacturers in need of a high-precision mask aligner instrument. With its powerful capabilities, precise alignment equipment, and advanced safety features, MPA-600 FA is an ideal tool for achieving optimal results in wafer-level packaging applications.
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