Used DNS / DAINIPPON 80A #9161819 for sale

DNS / DAINIPPON 80A is a photoresist film system from DNS Screen Mfg. Co., Ltd. The system consists of a photopolymerized base material, an exposure-sensitized film, and a developing solution. The resulting photoresist film is used to form integrated circuits, semiconductor devices, and MEMS devices. The photoresist film consists of a photosensitive material sandwiched between two layers of glass. A light-sensitive material is laser-etched onto the glass substrate and a sealing agent is applied to protect the film against both air and water. Photopolymerized coating helps to increase the resolution and depth of the photoresist film. The photosensitive material can be exposed to various wavelengths of light, or a laser beam, depending on the type of design required. This allows for fine tuning of the pattern and line widths for precision circuit designs. The material is exposed to ultraviolet (UV) radiation which is converted to visible light through a scattering process. This light selectively activates the photopolymerized material and causes it to harden to a durable form. The material is then left to develop, where it is immersed in a developer such as a sodium hydroxide solution. This induces the photosensitive material to swell and soften and allows for the parts of the material that were exposed to light to remain rigid, producing a coloured image on the photoresist material. Once the developing process is complete, the photoresist material is placed in an acid bath which etches the film. This process removes the material which was left exposed to the UV radiation during the development phase. The acid etching process is necessary in order to create a smooth, clean surface for mounting components and allows for a decrease in line widths and an increase in resolution. DNS 80A is a cost effective photoresist system with improved resolution and level of detail compared to similar systems. It enables the precise design of integrated circuits, microelectronic devices and MEMS devices, providing a highly reliable, high quality finish. In addition, it offers improved adhesion and flexibility, reducing the chances of cracking and other common problems encountered when making complex components.