Used KLA / TENCOR 4000 SURFSCAN #9157364 for sale

KLA / TENCOR 4000 SURFSCAN is a next-generation, state-of-the-art wafer testing and metrology equipment. It is designed to provide rapid, precise, and automated inspection of patterned wafers, allowing for process monitoring, defect management, and improved yields. The system is composed of a lightweight optical microscopy subsystem, an acoustic imaging subsystem, and an image processing subsystem. The optical subsystem of the Surfscan uses advanced imaging capabilities to allow for high resolution defect inspection and dimensional/morphology measurements in multiple magnifications. This unit utilizes both darkfield and brightfield microscopy properties, along with optional UV illumination, to enable a wide range of wafer inspection applications. It is capable of detecting and imaging sub-micron-level defects on patterned wafers with precision and accuracy. The acoustic imaging subsystem of KLA 4000 SURFSCAN utilizes laser acoustic microscopy to deliver non-destroyive focal characteristics across a wide range of wafer sizes and thicknesses. This feature is especially useful for detecting defects in ultra-low-k dielectrics and for inspecting buried layers deep within wafers. The acoustic imaging subsystem is capable of detecting feature sizes ranging from 300 nm to 10 microns, with a high level of distinction between similar features and a variety of defect types. The image processing and analysis subsystem of the Surfscan utilizes advanced algorithms to perform automated image segmentation, pattern recognition, and image classification. It also has the capability to detect changes within defined processes, identify patterns, and characterize a wide range of wafer features and defects. The image processing and analysis machine is designed to give a detailed overview of wafer properties, both during initial inspection and during wafer run-time monitoring. This enables rapid troubleshooting and allows for quick product acceptance. TENCOR 4000 SURFSCAN provides an efficient, cost effective solution for wafer testing and metrology. Its combination of advanced imaging capabilities, acoustic imaging, and image processing and analysis capabilities allow for the detection and characterization of various defects with high precision and accuracy. This tool is ideal for wafer testing, process monitoring, and defect management, allowing manufacturers to improve yields while reducing costs.