Used KLA / TENCOR Acrotec 6020 #9196856 for sale

KLA / TENCOR Acrotec 6020 is a high throughput wafer testing and metrology equipment that is designed to provide time and accuracy efficient inspection capabilities. It offers the ability to perform fast automatic wafer inspection, test pattern integrity, wafer radioactivity and layer thickness measurements. The system is designed to reduce material and time requirements, while providing reliable results and offering temperature and force control during the inspection and metrology process. The unit incorporates a robotic arm with a CCD camera to automate wafer search, sample placement, and imaging. KLA Acrotec 6020 uses advanced laser scanning and sensing technologies and infrared (IR) cameras to perform measurements with extreme accuracy. The machine offers a comprehensive set of optical metrics for the evaluation of wafer backside, including surface uniformity, alignment, and film thickness. Its advanced optical sensors and imaging capabilities allow it to locate features on the wafer quickly and precisely. TENCOR 6020 also features the latest in SpecIMA microscopes and spectrometers, to provide full wafer analysis. The tool incorporates SpectraDIC algorithms to detect defects in wafer metrology. It also has a fully featured optical imaging module which increases the sensitivity and accuracy of surface characterization and defect detection. KLA / TENCOR 6020 also offers contact and non-contact surface topography measurement services. The asset is equipped with enhanced temperature and force control which allows it to obtain the optimum conditions for metrology applications. It also has a fully automated calibration module which can be done remotely with ease. The model's advanced control software, which is accessible via the internet, allows users to customize their tests as needed. 6020 is an advanced wafer testing and metrology equipment that provides the latest in wafer testing and metrology technologies, providing reliable, accurate and timely results. It offers the ability to perform fast automatic wafer inspection, test pattern integrity, wafer radioactivity and layer thickness measurements, as well as the capability to perform contact and non-contact surface topography measurement services. The system is equipped with enhanced temperature and force control and a fully automated calibration module. It also has a fully featured optical imaging module which increases the sensitivity and accuracy of surface characterization. With its advanced laser scanning technology, it offers a comprehensive set of optical metrics for the evaluation of wafer backside. The unit also incorporates SpectraDIC algorithms to detect defects in wafer metrology. It is an optimal solution for obtaining efficient and reliable inspection and metrology results.