Used KLA / TENCOR AIT XP+ #173057 for sale

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KLA / TENCOR AIT XP+
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ID: 173057
Vintage: 2001
Patterned wafer inspection system AIT-III upgraded to AIT-XP Standard throughput High sensitivity throughput: 120 nm spec; 90 nm in practice No Bright Field Good sensitivity on metal coated wafers Dual EFAM: (25) wafer, 8" insert in 12" FOUP (25) wafer, 12" FOUP 2001 vintage.
KLA / TENCOR AIT XP+ is a powerful and industry-leading wafer testing and metrology equipment designed to meet high-end requirements. It is specially built to parse through the most difficult and intricate wafer materials, offering the highest precision when evaluating and inspecting samples. Through its combination of advanced optics and wafer analysis software, KLA AIT XP+ offers exceptional throughput and sampling rates, as well as robust, fully automated equipment to support high-complexity failure analysis inspection tasks. The XP+ offers an integrated surface inspection system, combining high-resolution, high-fidelity CCD imaging for defect detection, optical metrology for dimension measurements, and surface analysis systems for material composition and surfaces characterizations. Its advanced imaging technology is able to detect defects at sizes ranging from less than one micron to over 10 microns deep. Additionally, its automated navigation unit allows for rapid searches and inspection, saving time and improving accuracy. The machine also offers advanced, fully-automated analysis capability as well as rapid failure identification and sorting capabilities. By using combined deterministic and probabilistic parsing algorithms, the tool's artificial intelligence is able to identify and classify multiple types of defects quickly and accurately. Moreover, the asset can be customized to the specific application needs whether it is for photolithography, focused ion beam, or Atomic Force Microscopy (AFM) operations. Overall, TENCOR AIT-XP+ wafer testing and metrology model is a highly advanced solution to the challenges and complexities of micron-scale defect detection, inspection, and analysis. It combines a powerful optical equipment, integrated imaging, and advanced software to identify defects of a breadth of sizes more quickly and accurately than ever before. With its fully-automated analysis and failure identification capabilities, the system is able to provide important insights into the quality and reliability of wafers while providing an efficient and cost-effective solution.
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