Used KLA / TENCOR F5 #9214704 for sale

KLA / TENCOR F5 is an atomic force microscope-based wafer testing and metrology equipment designed for production and development of semiconductor devices. The system provides a robust platform for high-throughput testing and characterization of a range of wafer fabrics and finishes. It offers high-resolution, repeatable, and non-contact measurements of wafer features such as thickness, surface topography, grain size, and diffusion. The unit's integrated software capabilities provide automated measurement analysis and comprehensive data management and visualization capabilities. KLA F5 machine is comprised of several components, including an integrated platform hardware, AFM sensor, and control software. The integrated hardware consists of an AFM head, XY scanning stage, and precise z-height sensing. The tool's advanced AFM sensory capabilities allow it to scan over transparent and opaque surfaces, providing complex, high-resolution images of wafer features with a high degree of accuracy. The XY scanning stage allows the asset to rapidly traverse large areas of wafer, while the z-height sensing accurately positions the AFM head to capture data. The model's integrated software control program provides comprehensive automation and data management capabilities. The software allows users to easily define complex tests, automate acquisition of highly reproducible data, and manage large datasets for robust comparison and statistical analysis. It also provides powerful visualization tools for optimizing test design, evaluating data, and reporting results. TENCOR F5 equipment is well suited for analyzing semiconductor wafer fabrics and processes, such as photoresist patterning, dielectric oxide etching, and diffusion. It is also capable of monitoring manufacturing process steps, such as lithography, film deposition, and mask alignment. This makes it an ideal solution for process evaluation and defect analysis. The system offers high-resolution imaging capabilities and repeatable data acquisition, enabling reliable detection and quantification of defects on a wafer and enabling optimized process control. Its automated data acquisition and analysis functions can be used to quickly identify and characterize defects and analyze the impact of process variations or design modifications.