Used KLA / TENCOR / PROMETRIX UV 1050 #9233594 for sale

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ID: 9233594
Wafer Size: 6"
Film thickness measurement system, 6".
KLA / TENCOR / PROMETRIX UV 1050 is a high-performance wafer testing and metrology equipment that is utilized for failure analysis, yield improvement, quality assurance and process characterization. It utilizes a lasers and imaging components that operate on the UV and Broadband IR wavelengths to provide high-contrast imaging of both product and base wafers. The system provides superior automated metrology capabilities that allow for improved throughput and accuracy, even during non-ideal measurements. Its advanced BCAM analyzer with 4K, 2K and 1K configuration options allows for precise characterization of arbitrarily complex features such as particle size, topography and thin film thickness. This ability to accurately characterize arbitrary features enables the unit to accurately detect yield-limiting defects. The machine's imaging components are also capable of detecting various particle types, allowing for improved process uniformity and tighter process control. Its patented lowroughness beam scanning also allows for more accurate imaging in challenging environments. Additionally, KLA UV 1050 features sophisticated software tools for efficient and easy wafer inspection, data acquisition, defect management and report generation. These tools are designed to help ensure that the data gathered is accurate, interpretable and of the highest quality. TENCOR UV-1050 is capable of being integrated into a comprehensive failure analysis tool, allowing a complete analysis of product defects from identification to root cause to yield improvement. Additionally, the asset is fully compatible with both KLA and TENCOR family of failure analysis systems, allowing for the sharing of data across systems. In conclusion, KLA UV-1050 is a state-of-the-art wafer testing and metrology model. Its specialized imaging components and advanced software tools enable the equipment to provide superior metrology capabilities, allowing for improved throughput and accuracy in non-ideal settings. Additionally, the system is capable of being fully integrated into a comprehensive failure analysis unit, allowing for improved yield improvement and process characterization.
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