Used KLA / TENCOR / PROMETRIX UV 1080 #9217742 for sale

KLA / TENCOR / PROMETRIX UV 1080 is a wafer testing and metrology equipment designed for inspection and analysis of semiconductor devices after fabrication. It utilizes advanced imaging technology and high-powered algorithms to map, measure, and categorize defects down to the nanometer level across a wide range of wafer sizes, shapes, and materials. The system features a high-power 100 watt UV Laser Imaging Head to capture accurate 3D images of the substrate surface. Using spectral imaging, the unit can detect both dark and light defects within optically transparent materials such as SU-8. The 1080 is engineered with advanced motorized stages for accurate in-chip die measurements and defect identification at magnifications up to 1000X. The machine offers intuitive image capture controls to capture high-resolution images, enabling side-by-side comparisons. The 1080 also provides seamless integration with standard-format CAD libraries and device models to ensure accurate histogram data and defect location mapping with nanometer accuracy. Additionally, the tool can measure a wide range of parameters, including surface roughness, defect area, and depth. Moreover, the asset provides a comprehensive suite of tools for the review, analysis, and resolution of defects. KLA 1080 model has been designed for the fast and accurate quantification of defects for all stages of device manufacturing and test. It offers defect resolution capabilities to verify process repeatability and reduce risks associated with fabrication process variability and material. TENCOR 1080 is ideal for evaluating and troubleshooting yield and yield loss issues, as well as for the implementation of SPC processes. It boasts fast and accurate defect imaging, detection, and quantification and powerful tools for data analysis, reporting, and presentation. Additionally, the equipment features automated wafer alignment for high-speed scanning, optional wafer handlers for throughput improvements, and improved die-to-die uniformity.