Used KLA / TENCOR / PROMETRIX UV 1280SE #9013077 for sale

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ID: 9013077
Wafer inspection system, 8" SMIF 2001 vintage.
KLA / TENCOR / PROMETRIX UV 1280SE is a state of the art wafer testing and metrology equipment that can be used in the semiconductor and optical industries. KLA UV-1280SE is designed for a wide range of applications, such as dielectric and topographic inspection, electrical metrology, optical inspection, positive lithography, and thin-film measurements. TENCOR UV 1280 SE features a field-enhanced optical platform, allowing for accurate measurement of a variety of materials, regardless of reflectivity or polarization. PROMETRIX UV 1280 SE is capable of collecting high-resolution 3D metrology data, as well as simultaneous field of view imaging. It uses a high-energy focused beam, floating objective stages, and two variable delay lines for placement and exposure of the sample for inspection. This allows for precise inspection and detection of various features on the sample wafer with minimal damage to structures on the surface. The system also features a range of different imaging capabilities, such as dark-field imaging, micropatterning, multiple patterning, and optical comparators. All of these imaging modes can be combined and used to accurately investigate the structure of the sample at multiple scales. The imaging capabilities of KLA UV 1280 SE are combined with advanced software that is designed to identify and measure features of interest in rapid time. KLA UV 1280SE also features specialized non-contact instruments for film thickness measurement. It is equipped with both a monochromator based spectrometer and a multi-wavelength laser for precise and controlled thickness measurements. The unit is equipped with a wide range of incident angles that can be used to measure each layer's thickness on the sample wafer. The instrument can measure private slits as well as hexagonal structures, with the help of photoresist imaging. Overall, PROMETRIX UV 1280SE is a one-stop machine for conducting a wide range of wafer tests with accuracy and speed. Its advanced imaging capabilities allow for precise 3D measurements of nanoscale features, while its variable-angle instruments are perfect for measuring film thickness. Additionally, its robust software feature allows for efficient and automatic measurements of target locations, making it a valuable tool for semiconductor and optical industries.
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