Wafer Grinding, Lapping & Polishing

Super precision lens and mold polishing system Work size: 400 x 200 mm Warehoused 1995 vintage.

Triple wheel polishing table (3) Polymet polisher/grinders Each polisher/grinder has independent controls Power rating: 115V, 60Hz, 20.0A.

Fully integrated post-CMP cleaner for dry-in, dry-out processing Double side PVA cleaning through 2-brush boxes using common chemistries Cleaner water tracks and non-contact rinse ring for minimal surface contact SECS-II and GEM compliant.

Surface grinding machine, 1991 vintage.

Grinding machine, 1996 vintage.

Tool grinder, 1977 vintage.

Surface grinding machine.

HSS bottle shakers Shaker 1 Specifications: 208 V 1 phase 50/60 Hz 3 A 2006 vintage.

CMP system.

Lapper.

Surface grinder Class A 1983 vintage.

Precision Lapping and Polishing System Touch panel controller Individual LCD displays Plate speed: 0 to 70 rpm Main drive timer: up to 10 hours Eccentric drive 110 V, 60 Hz, 3 A Not included: Slurry cylinder with system.

Wafer back grinder.

Automatic curve generator, 100-120mm, does not include magazine plate or turntable.

Grinder 380V, 50Hz, 2.5kW 1988 vintage.

Wafer grinder.

Hardness tester, 2002 vintage.

Lapping machine, tank attached, 1990 vintage.

Polishing Machine, 3motor, LCD touch panel, tank attached, 2001 vintage.

Hand feed surface grinder Travel: 19" x 6.75" Needs 6" x 18" magnetic chuck Grinding wheel: 7" x 0.5" x 1.25" Elevating wheel granulations: 0.0005" Gross feed wheel granulations: 0.001" 3,540 rpm Direct spindle drive 1 HP 220/440/3/60.