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6644 results for found: used Etchers / Ashers

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  • ADIXEN: AMS 110

    ADIXEN AMS 110 DRI Etcher, 6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+Lauda chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Subtrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.
  • ADIXEN: AMS 110

    ADIXEN AMS 110 DRI Etcher, 6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+Lauda chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Subtrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.
  • AGS: -

    AGS - RIE Etcher.
  • ALCATEL: 601E

    ALCATEL 601E Automatic Etcher, 4" Specifications: The basic system consists of a single wafer vacuum load-lock assembly connected to a processing chamber This chamber is fitted with a proprietary high-density, low-pressure plasma source and a temperature-controlled chuck The chuck temperature can be adjusted from –30C to +60C The machine is equipped with an electrostatic clamp substrate holder for 4" wafers Process control and monitoring are achieved with a programmable logic controller (PLC) connected to a PC, which operates the machine in manual, semi-automatic, or fully-automatic modes The system is robot loaded, through the wall designed and allows for easy maintenance and troubleshooting Process Module: Room (Bosch) temperature process. (including Bosch patent) Substrate holder electrostatic clamping system Wafer centering kit 100mm Source: 2kW RF Bias: 0.5kW RF Heated process chamber walls Laser view port adapter on top of the source Reactor Pumping: Alcatel ADP 122 Maglev turbomolecular pump ATH 1300M DN200 heated throttle & isolation valve VAT series 64 + by-pass Completed pumping line is heated, while a coldtrap is installed before the dry pump Gas lines: 4 UNIT mfc’s, type 1 gas lines, installed in the main frame of the A601E SF6-500 sccm, C4F8 – 200400? sccm, O2 –20 sccm, O2-200 sccm Load/Unload Module: Robot loading Optical fiber for wafer localization Ferrofluidics feedthrough on transfer arm Molecular drag pump MDP 5011 Mechanical pump needed Control Module: PLC & PC Windows NT & Alcatel GUI Telediagnostic(modem & software) Basic configuration Genmark 4 robot with wafer aligner: yes 4” single wafer vacuum loadlock assembly: yes Chuck table with controlled-temperature from –30C~ +60C: yes Substrate holder: 4” wafer electrostatic clamping system with center kit: yes Low-pressure plasma source with laser view port adaptor on top of the source: yes System control and monitoring with PLC & PC, Windows NT & Alcatel GUI: yes UPS power for PLC control: yes, but the rechargeable batteries need to be replaced Chamber primary pump: ADP122: yes Cold trap with heated pump line: yes Maglev turbomolecular pump: ATH 1300M: yes DN 200 heated throttle & isolation valve VAT series 64 + By-pass + line with controller: yes Loadlock dry pump ACP20: no, it was replaced with ACP28 Loadlock molecular pump MDP 5011: yes Lauda Chiller RK8CP: yes Power transformer: input AC200-220V, output AC400V Baratron 100Pa: yes Ion gauge: not sure, probably no Source power supply: 2kW RF with RF20S generator controller: yes Bias power supply: 500W with RF5S generator controller: yes Robot loading version: yes User’s manual on CD ROM and PC HD: yes Electrical schematics on cleanroom paper: yes Telediagnostic (modem+software):yes Substrate holder: Electrostatic clamping system version Additional spare electrostatic ceramic (4”): yes, but used Pumping station: ADP122 and ACP28 dry pumps pack for process chamber and loadlock Gas lines: Gas cabinet for 6 gas lines Different UNIT MFC’s flow range/standard Transfer module and loadlock GENMARK cassette loading robot Flat finder/aligner Documentation: Hard copy of the user manual Documentation set on cleanroom paper CD-ROM with User manual Normal Paper: manuals of all sub-units Cleanroom Paper: Electrical diagrams Additional Parts: Cryo kit for Bosch and Cryo process Electrostatic Chuck 6” wafer size kit for manual or robot loading version Tool has been mainly used for R&D purposes.
  • ALCATEL: AMS 3200A

    ALCATEL AMS 3200A Etching system, 8" Can be retrofitted to 6" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.
  • ALCATEL: AMS 3200A

    ALCATEL AMS 3200A Etching system, 8" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.
  • ALCATEL: 601E

    ALCATEL 601E DRIE, 6" Poly etch Oxide etch Nitride etch Hardware Gaslines: SF6 (MFC1000), C4F8 (MFC400), O2 MFC200), Ar (MFC1500) and CF4 (MFC200) Generators: Source: RFP RF305 (3000W max.) BIAS: Advanced Energy LF-5 (500W, pulsed & continous mode) Vacuum: Chamber Rough: Alcatel ADP122P Chamber Turbo: Alcatel ATH 1600M Loadlock Rough: Alcatel ADP 16 Loadlock Turbo: Alcatel MDP5011 Chiller: Lauda RK8CP (Glykol) Handler: Genmark Clamping: mechanical clamping with ceramic clamp (optional metalic clamp available) Electrostatic Clamping system optional available Heated liner: not installed (optional available) Software Windows NT Workstation PC Version 5.2.9.8-3#52 PLC Version V6.6 Basic Version V4.30 Machine hours: 48.251h Plasma hours: 1.160h Previously used for DRIE mono Si etch Can be inspected.
  • ALCATEL: 601E

    ALCATEL 601E DRIE, 6" Poly etch Oxide etch Nitride etch Bosch process Hardware Gaslines: SF6 (MFC1000), C4F8 (MFC400), O2 MFC200), Ar (MFC1500) and CF4 (MFC200) Generators: Source: RFP RF305 (3000W max.) BIAS: Advanced Energy LF-5 (500W, pulsed & continous mode) Vacuum: Chamber Rough: Alcatel ADP122P Chamber Turbo: Alcatel ATH 1600M Loadlock Rough: Alcatel ADP 16 Loadlock Turbo: Alcatel MDP5011 Chiller: Lauda RK8CP (Glykol) Handler: Genmark Clamping: mechanical clamping with ceramic clamp (optional metalic clamp available) Electrostatic Clamping system optional available Heated liner: not installed (optional available) Software Windows NT Workstation PC Version 5.2.9.8-3#52 PLC Version V6.6 Basic Version V4.30 Machine hours: 48.251h Plasma hours: 1.160h Previously used for DRIE mono Si etch Currently installed Can be inspected 2001 vintage.
  • ALCATEL: AMS 200 I-SPEEDER

    ALCATEL AMS 200 I-Speeder ICP Si dry etcher, 4" flat wafer 1 reactor Dry pump Gas: SF6/C4F8/O2/Ar Wafer transfer time is < than 3 minutes 6" chuck and fixtures included 2005 vintage.
  • ALCATEL: 601E

    ALCATEL 601E DRIE, 4"-6" Bosch process Hardware: 4 MFC: SF6 (500sccm max) C4F8 (400sccm max) O2 (200sccm max) O2 (20sccm max) Generators: Source: RFPP RF20S (2000W Max) Bias: RFPP RF5S (500W Max), RFPP LF5S (500W Max) Vacuum: Chamber Rough: Alcatel ADP 122P Chamber Turbo: Alcatel ATH 1300M Loadlock Rough: Alcatel Rotary Pump Chiller Clamping: Mechanical clamping with metalic clamp.
  • ALCATEL: AMS 200 SE

    ALCATEL AMS 200 SE Dry etchers, 6" ESC Chuck Pumps and chillers included Currently crated 2005-2006 vintage.
  • ALCATEL: 601E

    ALCATEL 601E Etcher Gases used: Argon, N2, AR, O2, CHF3, CHF8, SF6.
  • ALCATEL: AMS 4200

    ALCATEL AMS 4200 Etcher (1) Chamber Process: Deep silicon bosch SF6, C4F8, O2, Ar, N2, He, CHF3 Brooks platform Dual loadlocks Magnatron 7 ALCATEL ACT 600M TMP User interface PC Transfer PC Process chamber: AMS X200 ALCATEL ACT 1300M TMP Process gases: SF6 1000sccm C4F8 400sccm O2 100sccm O2 800sccm Ar 200sccm N2 1000sccm Ar CHF3 EDM CS200-11729 200 / 208VAC, 3 Phase, 50/60Hz ALCATEL AMS X200 (2) SEMCO HV52000C SEREN L301 RF Advanced energy dressler cesar RF ENI Spectrum B-3013 RF 200/208VAC, 3 Phase, 50/60Hz 2008 vintage.
  • ALCATEL: AMZ 200SE

    ALCATEL: AMZ 200SE Deep reactive ion etcher, 6", 2003 vintage.
  • ALCATEL: AMS 200

    ALCATEL AMS 200 SE i-speeder etcher, 6" Specifications: ESC chuck Automatic loading version Includes: Primary pumps : Loadlock : Alcatel Adixen ACP 28 Main Chamber : Alcatel Adixen A300 H Alcatel Adixen ATH 1600M Turbo pump Lauda T1200 Chiller RF Generator : 1 ENI ACG3B 1 Advanced Energy LF-5 GAS (MFC's): N2 (1500) O2 (200) Ar (200) He (200) SF6 (1000) C4F8 (400) Currently stored in cleanroom 2004 vintage.
  • ALCATEL: AMS 200

    ALCATEL AMS 200 SE i-speeder etcher, 6" Specifications: ESC chuck Automatic loading version Includes: Primary pumps : Loadlock : Alcatel Adixen ACP 28 Main Chamber : Alcatel Adixen A300 H Alcatel Adixen ATH 1600M Turbo pump Lauda T1200 Chiller RF Generator : 1 ENI ACG3B 1 Advanced Energy LF-5 GAS (MFC's): N2 (1500) O2 (200) Ar (200) He (200) SF6 (1000) C4F8 (400) Currently stored in cleanroom 2005 vintage.
  • ALCATEL: AMS 200

    ALCATEL AMS 200 SE i-speeder etcher, 6" Specifications: ESC chuck Automatic loading version Includes: Primary pumps : Loadlock : Alcatel Adixen ACP 28 Main Chamber : Alcatel Adixen A300 H Alcatel Adixen ATH 1600M Turbo pump Lauda T1200 Chiller RF Generator : 1 ENI ACG3B 1 Advanced Energy LF-5 GAS (MFC's): N2 (1500) O2 (200) Ar (200) He (200) SF6 (1000) C4F8 (400) Currently stored in cleanroom 2005 vintage.
  • ALCATEL: AMS 200

    ALCATEL AMS 200 SE i-speeder etcher, 6" Specifications: ESC chuck Automatic loading version Includes: Primary pumps : Loadlock : Alcatel Adixen ACP 28 Main Chamber : Alcatel Adixen A300 H Alcatel Adixen ATH 1600M Turbo pump Lauda T1200 Chiller RF Generator : 1 ENI ACG3B 1 Advanced Energy LF-5 GAS (MFC's): N2 (1500) O2 (200) Ar (200) He (200) SF6 (1000) C4F8 (400) Currently stored in cleanroom 2005 vintage.
  • ALCATEL: AMS 200

    ALCATEL AMS 200 SE i-speeder etcher, 6" Specifications: ESC chuck Automatic loading version Includes: Primary pumps : Loadlock : Alcatel Adixen ACP 28 Main Chamber : Alcatel Adixen A300 H Alcatel Adixen ATH 1600M Turbo pump Lauda T1200 Chiller RF Generator : 1 ENI ACG3B 1 Advanced Energy LF-5 GAS (MFC's): N2 (1500) O2 (200) Ar (200) He (200) SF6 (1000) C4F8 (400) Currently stored in cleanroom 2005 vintage.
  • ALCATEL: 601E I-SPEEDER

    ALCATEL 601E I-Speeder Silicon etcher, 6" Wafer size: 6", converted from 4" Semco ESC Genmark 4 robot with wafer aligner 4" single wafer vacuum loadlock assembly Chuck table with controlled-temperature from -30°C~ +60°C Substrate holder: 4" wafer electrostatic clamping system with center kit Low-pressure plasma source with laser view port adaptor on top of the source System control and monitoring with PLC & PC, Windows NT & Alcatel GUI UPS power for PLC control Operates the machine in manual, semi-automatic, or fully-automatic modes Chamber primary pump: ADP122 Cold trap with heated pump line Maglev turbomolecular pump: ATH 1300M DN 200 heated throttle & isolation valve VAT series 64 + By-pass + line with controller Loadlock dry pump ACP28 Loadlock molecular pump MDP 5011 Lauda Chiller RK8CP Power transformer: input AC200-220V, output AC400V Baratron 100Pa Source power supply: 2kW RF with RF20S generator controller Bias power supply: 500W with RF5S generator controller Robot loading version User's manual on CD ROM and PC HD Electrical schematics on cleanroom paper Telediagnostic (modem+software) Process Module: Room (Bosch) temperature process. (including Bosch patent) Substrate holder electrostatic clamping system Wafer centering kit 100mm Source: 2kW RF Bias: 0.5kW RF Heated process chamber walls Laser view port adapter on top of the source Reactor Pumping: Alcatel ADP 122 Maglev turbomolecular pump ATH 1300M DN200 heated throttle & isolation valve VAT series 64 + by-pass Completed pumping line is heated, while a coldtrap is installed before the dry pump Gas lines: 4 UNIT mfc's, type 1 gas lines, installed in the main frame of the A601E SF6-500 sccm, C4F8 - 200400 sccm, O2 -20 sccm, O2-200 sccm oad/Unload Module: Robot loading Optical fiber for wafer localization Ferrofluidics feedthrough on transfer arm Molecular drag pump MDP 5011 Mechanical pump needed Control Module: PLC & PC Windows NT & Alcatel GUI Telediagnostic(modem & software) Substrate holder: Electrostatic clamping system version Additional spare electrostatic ceramic (4"): yes, but used Pumping station: ADP122 and ACP28 dry pumps pack for process chamber and loadlock Gas lines: Gas cabinet for 6 gas lines Different UNIT MFC's flow range/standard Transfer module and loadlock GENMARK cassette loading robot Flat finder/aligner Documentation: Hard copy of the user manual Documentation set on cleanroom paper CD-ROM with User manual Normal Paper: manuals of all sub-units Cleanroom Paper: Electrical diagrams Additional Parts: Cryo kit for Bosch and Cryo process Electrostatic Chuck 6" wafer size kit for manual or robot loading version Tool has been mainly used for R&D purposes Modifications: RK8CP chiller Upgrade of Maglev ATH 1300 to ATH 1600 turbomolecular pump Upgrade of ACP20 to ACP28 dry pump 51 foot pump cable Light tower Upgrade of 2 kW RFPP generator to ENI 3 kW RF generator UNIT MFC: SF6 / 1000 sccm UFC 180 SECS II protocol Software upgrade (PC and pLC) 2001 vintage.
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