Die Attachers

ALPHASEM SL 9006 Die bonder Currently de-installed.

ALPHASEM SL 9006 Die bonder Currently de-installed.

ALPHASEM ETOL40R Analysis system 2014 vintage.

ASM AD 838L Die bonders, 6" Machine main unit Rotary bond head capability Multi-magazine input elevator.

ASM AD 838 Die bonder 2011 vintage.

ASM AD 838 Die bonder 2011 vintage.

ASM AD 889 Die bonder 2000 vintage.

ASM 838 Die bonders 2015 vintage.

ASM 838 Die bonders 2015 vintage.

ASM AS 899 Die sorter Dual linear bond heads Fast pattern recognition system PC based control system Hi-PEC Motion control With AC servo motors for workholder bin table Package handling system: Motion with 4 degrees of freedom: XYZθ Ample bondhead movement Programmable bond force control Precise pick & place system performance XY Placement accuracy: ± 1.5 mil Die rotation: ± 3° Testing stage: Excellent 360° rotary Direct drive rotary Package positioning directly under the IS opening for light capture Eagle vision system: CCD Cameras with zoom lens Adjustable LED lighting system (256) Grey levels PRS Click & Fit bin block assembly: Wide travel range: 12" x 18" Flexible bin blocks Test station: Stationary sensor Probe pin.

ASM AD 896M-IL08 Automatic multi-wafer die bonder With vacuum pump 2008 vintage.

ASM AD 830 Die bonders 2009-2011 vintage.

ASM AD 898 Die bonder 2003-2004 vintage.

ASM AD 896M-IL08 Automatic multi-wafer die bonder With vacuum pump 2008 vintage.

ASM AD 830 Die bonder.

ASM AD 838 Die bonder 2015 vintage.

ASM AD 838 Die bonder 2015 vintage.

ASM AD 8912 Die bonder.

ASM AD 838 Die bonder 2011 vintage.

ASM AD 896M-IL08 Automatic multi-wafer die bonder With vacuum pump 2008 vintage.