Etchers / Ashers

ADIXEN AMS 110 DRIE Etcher, 4"-6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+Lauda chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Subtrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 100 DRI Etcher.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro Electro Mechanical System) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

ADIXEN AMS 110 DRI Etcher, 6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+Lauda chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Subtrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro Electro Mechanical System) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

ADIXEN AMS 110 DRI Etcher, 6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+Lauda chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Subtrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 110 DRIE Etcher, 4"-6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+LAUDA Chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Substrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro electro mechanical system) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

ADIXEN AMS 110 DRIE Etcher, 4"-6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+LAUDA Chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Substrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro Electro Mechanical System) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro Electro Mechanical System) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

ADIXEN AMS 110 DRIE Etcher, 4"-6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+LAUDA Chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Substrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro Electro Mechanical System) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro Electro Mechanical System) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro Electro Mechanical System) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

AE PEⅡ10K Power supplies.

ALCATEL / ADIXEN / PFEIFFER 601E Deep reactive ion etcher, 6" Mechanical clamp Backside He cooling RFPP RF20S RF Generator RFPP LF5 RF Generator ALCATEL / ADIXEN Turbo pump Vacuum pump & chiller Current gas configuration: SF6 C4F8 CHF3 O2 AR N2.

ALCATEL / ADIXEN / PFEIFFER AMS 200 Deep silicon etcher, 6" Process: BOSCH Type: ESC Atmospheric robots: GENMARK 2LA070223 Electro-static chuck ESC pin: Ceramic (3) Bias generators: ENI MKS Spectrum B-3013 SEREN L301.

ALCATEL: AMZ 200SE Deep reactive ion etcher, 6", 2003 vintage.

ALCATEL AMS 200 I-Productivity system ESC & Atmospheric robot.