Etchers / Ashers

ADIXEN AMS 110 DRIE Etcher, 4"-6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+Lauda chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Subtrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 100 DRI Etcher.

ADIXEN AMS 110 DRI Etcher, 6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+Lauda chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Subtrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 110 DRIE Etcher, 4"-6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+LAUDA Chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Substrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 110 DRI Etcher, 6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+Lauda chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Subtrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 100 DRI Etcher, 4" BOSCH Deep silicon etch process / Cryogenic etch process MEMS (Micro electro mechanical system) Microfluidics Silicon master: Soft lithography stamps Photo resist / Thermal oxide LF & HF Option: Controlled footing at bottom of etch Gases: C4F8: Octafluorocyclobutane SF6: Sulfur hexafluoride O2: Oxygen Processes: BOSCH High frequency: Fast etching BOSCH Low frequency: Etch silicon down to buried oxide on SOI wafer.

ADIXEN AMS 110 DRIE Etcher, 4"-6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+LAUDA Chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Substrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

ADIXEN AMS 110 DRIE Etcher, 4"-6" ICP Etching system for silicon Includes: Vacuum pumps, chiller Process chamber: Bosch licence Substrate holder in ESC finger clamping version+LAUDA Chiller type RK8CP Wafer centering kit Source power supply: 3 kW RF Bias power supply: 300 W LF Chamber primary pump: ADIXEN Dry pump (ADP 122) Chamber maglev turbo molecular pump: ADIXEN ATH 1600 MT DN 200 Throttle valve VAT 61 series Gas lines: SF6/1000 sccm C4F8/400 sccm O2/200 sccm Load-lock: Single wafer manual vacuum load lock including: One cover (Aluminium and plexiglass) Manual wafer transfer arm: Load-lock and process chamber Control module: Allen bradley PLC and industrial PC with its UPS User interface: Windows 2000 Separate electrical cabinet including main control panel RF/LF generators and PLC AMS 100 system is delivered with 10m cable: Electrical cabinet Process module Documentation: Users / Maintenance manual on CD-ROM and PC hard disk Electrical schematics on standard paper Components manual on CD-ROM Options: Basic structure: Heated liner installed in source chamber Automatic load lock Pumping station: Heated valve VAT 65 series and by-pass valve End point detection: Digilem 200: IR (905nm) Camera Substrate holder 100 mm kit: 4" Additional ESC pin 2007 vintage.

AE PEⅡ10K Power supplies.

AGS - RIE Etcher.

ALCATEL 601E Automatic Etcher, 4" Specifications: The basic system consists of a single wafer vacuum load-lock assembly connected to a processing chamber This chamber is fitted with a proprietary high-density, low-pressure plasma source and a temperature-controlled chuck The chuck temperature can be adjusted from –30C to +60C The machine is equipped with an electrostatic clamp substrate holder for 4" wafers Process control and monitoring are achieved with a programmable logic controller (PLC) connected to a PC, which operates the machine in manual, semi-automatic, or fully-automatic modes The system is robot loaded, through the wall designed and allows for easy maintenance and troubleshooting Process Module: Room (Bosch) temperature process. (including Bosch patent) Substrate holder electrostatic clamping system Wafer centering kit 100mm Source: 2kW RF Bias: 0.5kW RF Heated process chamber walls Laser view port adapter on top of the source Reactor Pumping: Alcatel ADP 122 Maglev turbomolecular pump ATH 1300M DN200 heated throttle & isolation valve VAT series 64 + by-pass Completed pumping line is heated, while a coldtrap is installed before the dry pump Gas lines: 4 UNIT mfc’s, type 1 gas lines, installed in the main frame of the A601E SF6-500 sccm, C4F8 – 200400? sccm, O2 –20 sccm, O2-200 sccm Load/Unload Module: Robot loading Optical fiber for wafer localization Ferrofluidics feedthrough on transfer arm Molecular drag pump MDP 5011 Mechanical pump needed Control Module: PLC & PC Windows NT & Alcatel GUI Telediagnostic(modem & software) Basic configuration Genmark 4 robot with wafer aligner: yes 4” single wafer vacuum loadlock assembly: yes Chuck table with controlled-temperature from –30C~ +60C: yes Substrate holder: 4” wafer electrostatic clamping system with center kit: yes Low-pressure plasma source with laser view port adaptor on top of the source: yes System control and monitoring with PLC & PC, Windows NT & Alcatel GUI: yes UPS power for PLC control: yes, but the rechargeable batteries need to be replaced Chamber primary pump: ADP122: yes Cold trap with heated pump line: yes Maglev turbomolecular pump: ATH 1300M: yes DN 200 heated throttle & isolation valve VAT series 64 + By-pass + line with controller: yes Loadlock dry pump ACP20: no, it was replaced with ACP28 Loadlock molecular pump MDP 5011: yes Lauda Chiller RK8CP: yes Power transformer: input AC200-220V, output AC400V Baratron 100Pa: yes Ion gauge: not sure, probably no Source power supply: 2kW RF with RF20S generator controller: yes Bias power supply: 500W with RF5S generator controller: yes Robot loading version: yes User’s manual on CD ROM and PC HD: yes Electrical schematics on cleanroom paper: yes Telediagnostic (modem+software):yes Substrate holder: Electrostatic clamping system version Additional spare electrostatic ceramic (4”): yes, but used Pumping station: ADP122 and ACP28 dry pumps pack for process chamber and loadlock Gas lines: Gas cabinet for 6 gas lines Different UNIT MFC’s flow range/standard Transfer module and loadlock GENMARK cassette loading robot Flat finder/aligner Documentation: Hard copy of the user manual Documentation set on cleanroom paper CD-ROM with User manual Normal Paper: manuals of all sub-units Cleanroom Paper: Electrical diagrams Additional Parts: Cryo kit for Bosch and Cryo process Electrostatic Chuck 6” wafer size kit for manual or robot loading version Tool has been mainly used for R&D purposes.

ALCATEL AMS 3200A Etching system, 8" Can be retrofitted to 6" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.

ALCATEL AMS 3200A Etching system, 8" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.

ALCATEL AMS 3200A Etching system, 8" Can be retrofitted to 6" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 Bosch process mode (SF4 and C4F8) No EPD 2008 vintage.

ALCATEL AMS 3200A Etching system, 8" Can be retrofitted to 6" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.

ALCATEL AMS 3200A Etching system, 8" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.

ALCATEL AMS 3200A Etching system, 8" Can be retrofitted to 6" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.

ALCATEL AMS 3200A Etching system, 8" Can be retrofitted to 6" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.

ALCATEL AMS 3200A Etching system, 8" Can be retrofitted to 6" 200/208 VAC, 3 phases, 50/60 Hz Full load amps: 78 A Machine main switch rating: 80 A Amp. rating of largest load: 27 A Interrupt current: 10,000 AC Wiring configuration: 3 wires + 6ND 1 Load lock / 1 platform brooks Gas: SF6 / C4F8 / O2 / Ar; with high speed massflow 1 chamber DRIE with ESC: 1 gene source RF 3000W / 1 gene HF platen 300W / 1 gene LF platen 200W (anti notching kit) TSV last: 40x120um (open area < 1%), 9um/min @ <5% Selectivity/mask (JSR335 5um) >25: Selectivity / SiO2 (stop layer) > 50 2007 vintage.

ALCATEL 601E DRIE, 6" Poly etch Oxide etch Nitride etch Bosch process Hardware Gaslines: SF6 (MFC1000), C4F8 (MFC400), O2 MFC200), Ar (MFC1500) and CF4 (MFC200) Generators: Source: RFP RF305 (3000W max.) BIAS: Advanced Energy LF-5 (500W, pulsed & continous mode) Vacuum: Chamber Rough: Alcatel ADP122P Chamber Turbo: Alcatel ATH 1600M Loadlock Rough: Alcatel ADP 16 Loadlock Turbo: Alcatel MDP5011 Chiller: Lauda RK8CP (Glykol) Handler: Genmark Clamping: mechanical clamping with ceramic clamp (optional metalic clamp available) Electrostatic Clamping system optional available Heated liner: not installed (optional available) Software Windows NT Workstation PC Version 5.2.9.8-3#52 PLC Version V6.6 Basic Version V4.30 Machine hours: 48.251h Plasma hours: 1.160h Previously used for DRIE mono Si etch Currently installed Can be inspected 2001 vintage.