Flat Panel Display

FAS TECHNOLOGIES Micro E 200 Extrusion Coating System Includes Stacked Bake/Chill Oven System is capable of coatings over 100 micron thick in one process step with uniformities surpassing +/- 2% Material utilization is 75 percent compared to 5-10 percent for spin coating Increased process uniformity Uses high precision extrusion technology Ability to coat materials in a wide range of viscosities Repeatable digitally programmed process With Genmark Mini Max Gencobot 7S/3L Handler Model JS-9940 stacked bake unit with (3) ovens.

FAS TECHNOLOGIES Micro E 200 Extrusion Coating System Uses high precision extrusion technology to coat materials in a wide range of viscosities Coats very thick layers (100 micrometers) in a single step Repeatable digitally programmed process Greater material utilization than spin coating (typical 75% of dispensed material remains on the wafer).