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587 RESULTS FOUND FOR: used Ion Implanters & Monitors

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    APPLIED MATERIALS 9500xR Ion implanter.
  • AMAT / APPLIED MATERIALS: 9210

    APPLIED MATERIALS 9210 High current ion implanter, 8" Dual loadlock In-vac robot Hardware configuration: Processor module Beamline module Terminal module Power and control module Cryo compressor Beamline enclosure Wafer loader enclosure Electrodes MRS Tube Scum box Control module Wheel CGA 330 Gas bottle Wafer handler Cryo pump rack & heat exchanger Pumps: (2) CTI Cryopumps Diffusion pump LEYBOLD Turbovac 316C EDWARDS Dry pumps Energy : Extraction: 20 kV Acceleration: 160 kV (Max. beam energy 180 keV) Beam current: 100 µA - 20 mA (depends on species, energy) Tilt capabilty: 10° Wheel chamber: (17) Heatsinks for 200mm wafers Source type: Bernas (2) Vaporizers Gas system: External Ar (2) High pressure gas modules.
  • AMAT / APPLIED MATERIALS: 9210

    AMAT / APPLIED MATERIALS 9210 High current ion implanter, 8" Dual loadlock In-vac robot Hardware configuration: Processor module Beamline module Terminal module Power and control module Cryo compressor Beamline enclosure Wafer loader enclosure Electrodes MRS Tube Scum box Control module Wheel CGA 330 Gas bottle Wafer handler Cryo pump rack & heat exchanger Pumps: (2) CTI Cryopumps Diffusion pump LEYBOLD Turbovac 316C EDWARDS Dry pumps Energy: Extraction: 20 kV Acceleration: 160 kV (Max. beam energy 180 keV) Beam current: 100 µA - 20 mA (depends on species, energy) Tilt capability: 10° Wheel chamber: (17) Heat sinks for 8" (Wafers 200 mm) Source type: Bernas (2) Vaporizers Gas system: External Ar (2) High pressure gas modules.
  • AMAT / APPLIED MATERIALS: XR200S

    APPLIED MATERIALS xR200S Ion implanter Cassette to cassette Power requirements: 208 V, 180 A, 50/60 Hz, 3 Phase CE Marked 1999 vintage.
  • AMAT / APPLIED MATERIALS: XR80

    AMAT / APPLIED MATERIALS xR80 Implanter, 8" P/N: 0240-94906 Main system: xR-Leap SMIF System: LPT 2200 Hardware configuration: NOVAPURE Effluent gas scrubber EGS-237 Cooling system: Heat exchanger / Closed loop de-ionized water cooling system Wafer loader: (3) Carousel paddles Wafer orients: Batch notch orient Wheel chamber: (17) Heat sinks, 8" Control system: Fiber optic communication network Control module: VME Microprocessor Plasma flood gun: HDPFS Beam line: IHC Gas panel option: SDS Toxic gas modules for AsH3 & BF3 Tilt: Variable implant angle, +/-10 degrees Hard disk: 4 GB RAM: 128 MB CIM Linked 1996 vintage.
  • AMAT / APPLIED MATERIALS: 9210

    APPLIED MATERIALS 9210 High current ion implanter, 8" Dual loadlock In-Vac robot Hardware configuration: Processor module Beamline module Terminal module Power and control module Cryo compressor Beamline enclosure Wafer loader enclosure Electrodes MRS Tube Scum box Control module Wheel CGA 330 Gas bottle Wafer handler Cryo pump rack & heat exchanger Pumps: (2) CTI Cyropumps Diffusion pump LEYBOLD Turbovac 316C EDWARDS Dry pumps Energy : Extraction: 20 kV Acceleration: 160 kV (Max. beam energy 180 keV) Beam current: 100 µA - 20 mA (depends on species, energy) Tilt Capabilty: 10° Wheel chamber: (17) Heatsinks for 200mm wafers Source type: Bernas (2) Vaporizers Spares: Miscellaneous power supplies Amplifiers Consumables Spare robot included Gas system: External Ar (2) High pressure gas modules Currently de-installed.
  • AMAT / APPLIED MATERIALS: 9210

    APPLIED MATERIALS 9210 High current ion implanter, 8" Dual loadlock In-Vac robot Hardware configuration: Processor module Beamline module Terminal module Power and control module Cryo compressor Beamline enclosure Wafer loader enclosure Electrodes MRS Tube Scum box Control module Wheel CGA 330 Gas bottle Wafer handler Cryo pump rack & heat exchanger Pumps: (2) CTI Cyropumps Diffusion pump LEYBOLD Turbovac 316C EDWARDS Dry pumps Energy : Extraction: 20 kV Acceleration: 160 kV (Max. beam energy 180 keV) Beam current: 100 µA - 20 mA (depends on species, energy) Tilt Capabilty: 10° Wheel chamber: (17) Heatsinks for 200mm wafers Source type: Bernas (2) Vaporizers Spares: Miscellaneous power supplies Amplifiers Consumables Spare robot included Gas system: External Ar (2) High pressure gas modules Currently de-installed.
  • AMAT / APPLIED MATERIALS: 9210

    APPLIED MATERIALS 9210 High current ion implanter, 8" Dual loadlock In-vac robot Hardware configuration: Processor module Beamline module Terminal module Power and control module Cryo compressor Beamline enclosure Wafer loader enclosure Electrodes MRS Tube Scum box Control module Wheel CGA 330 Gas bottle Wafer handler Cryo pump rack & heat exchanger Pumps: (2) CTI Cryopumps Diffusion pump LEYBOLD Turbovac 316C EDWARDS Dry pumps Energy : Extraction: 20 kV Acceleration: 160 kV (Max. beam energy 180 keV) Beam current: 100 µA - 20 mA (depends on species, energy) Tilt capabilty: 10° Wheel chamber: (17) Heatsinks for 200mm wafers Source type: Bernas (2) Vaporizers Gas system: External Ar (2) High pressure gas modules.
  • AMAT / APPLIED MATERIALS: XR80

    APPLIED MATERIALS xR80 Implanter, 8".
  • AMAT / APPLIED MATERIALS: XR80

    AMAT / APPLIED MATERIALS xR80 Implanter, 8" P/N: 0240-94906 Main system: xR-Leap SMIF System: LPT 2200 Hardware configuration: NOVAPURE Effluent gas scrubber EGS-237 Cooling system: Heat exchanger / Closed loop de-ionized water cooling system Wafer loader: (3) Carousel paddles Wafer orients: Batch notch orient Wheel chamber: (17) Heat sinks, 8" Control system: Fiber optic communication network Control module: VME Microprocessor Plasma flood gun: HDPFS Beam line: IHC Gas panel option: SDS Toxic gas modules for AsH3 & BF3 Tilt: Variable implant angle, +/-10 degrees Hard disk: 4 GB RAM: 128 MB CIM Linked 1996 vintage.
  • AMAT / APPLIED MATERIALS: XR80

    APPLIED MATERIALS xR80 Implanter, 8" P/N: 0240-94906 Main system: xR-Leap SMIF System: LPT 2200 Hardware configuration: NOVAPURE Effluent gas scrubber EGS-237 Cooling system: Heat exchanger / Closed loop de-ionized water cooling system Wafer loader: (3) Carousel paddles Wafer orients: Batch notch orient Wheel chamber: (17) Heat sinks, 8" Control system: Fiber optic communication network Control module: VME Microprocessor Plasma flood gun: HDPFS Beam line: IHC Gas panel option: SDS Toxic gas modules for AsH3 & BF3 Tilt: Variable implant angle, +/-10 degrees Hard disk: 4 GB RAM: 128 MB CIM Linked 1996 vintage.
  • AMAT / APPLIED MATERIALS: 9500XR

    AMAT / APPLIED MATERIALS 9500xR Ion implanter.
  • AMAT / APPLIED MATERIALS: 9500XR

    AMAT / APPLIED MATERIALS 9500xR Ion implanter.
  • AMAT / APPLIED MATERIALS: 9500

    AMAT / APPLIED MATERIALS 9500 Implanter, 8" Bernas source Belt drive PA Tube 9600 Cryo compressors LEYBOLD Turbo controllers Isolation transformer Wheel, 8” Fixed restraints Clips & heat sinks Hollow gripper Single position beam stop Missing parts.
  • AMAT / APPLIED MATERIALS: XR80

    APPLIED MATERIALS xR80 Ion implanter Main components: Processor module Beam line module Source services module Processor rack Heat exchanger / PDU Mobile PC and desk Clean room monitor Control module (VME) Enclosure Signal tower TEM Probe VESDA Smoke detector: No ISO TX: No Mains matching TX Beamline, controllers PSU's and assy: Pre accel / Mag cont Beamline inst Vacuum cont Post A cont Turbo controllers Focus PSU Decel PSU: No A Mag PSU Pre A converter PSU Source mag PSU Suppression PSU Beam path components, source / Extraction / Flight tube / MRS and PFS assy: Source head type: IHC Extraction type: Dual bellows Flight tube MRS Pre defining PFS Type: STD PFS Gas cabinet (Source services): Module: SDS / HP GeF4: HP BF3: HP Module: SDS Module: SDS Purge module PSU's, Controllers and assy: Gas and temp cont Filament PSU Arc PSU Bias PSU DPS Pre A HV stack G2 PSU and Components Source ISO TX Vacuum system: Make / Model / Description LEYBOLD / 1000C / Source turbo pump LEYBOLD / 361C MRS / Turbo pump TURBOTRONIK / NT20 / Turbo pump controller EDWARDS / QDP40 / Beam line dry pump EDWARDS / QDP 80 / Processor dry pump EDWARDS / EH500A / Processor booster pump CTI / CTI-10 / Side cryo pump CTI / CTI-10 / Rear cryo pump - / - / Side cryo compressor - / - / Rear cryo compressor Processor PSU's controller and assy: Wheel and components Spin motor Gripper Transfer arm Clip actuator Blade A/B Sensor Tilt assy PFS DP Box Beam stop Beam profiler Filament PSU (PFS) Wafer loader / Mini environment assy: Carousel Indexer W/L Door Orientor Cassettes / Trays Arm servo PSU (XR80) Arm servo cont (XR80) Control rack: DAQPDU Option chassis Target sys inst W/L Cont W/L Vacuum Ground PDU Target sys vacuum Spin / Scan cont Direct drive interface Plasma flood chassis Scan amp Spin amp Spin / Scan PDU Bleed resistor Motech 80 VME: PMAC Vac / Atmos CPU Main board Loop cont Energy level: 2-80 Kev Currently installed 1997 vintage.
  • AMAT / APPLIED MATERIALS: 9500XR

    APPLIED MATERIALS 9500xR Ion implanter Cassette to cassette Power requirements: 208 V, 180 A, 50/60 Hz, 3 Phase CE Marked 1996 vintage.
  • AMAT / APPLIED MATERIALS: QUANTUM X

    AMAT / APPLIED MATERIALS Quantum X Ion implanter, 12".
  • AMAT / APPLIED MATERIALS: 9500XR

    AMAT / APPLIED MATERIALS 9500xR High current ion implanter, 6" Utility gas: Gas name / Pressure / Flow rate Ar (Process Ar) / 6.3Kg/cm² / 0.1 SLM PN2 (Process Vent) / 4.2Kg/cm³ / 7 SLM GN2 (Pneumatics) / 6.3Kg/cm^4 / 2 SLM Exhaust description: Type / Flow rate (CMM) / Size Beamline (SEX) / 17 / 200 mm Ion source (SEX) / 5.66 / 110 mm Fly tube (SEX) / 5.66 / 110 mm (2) Gas boxes (SEX) / 5.66 / 110 mm Back & control (GEX) / 11.3 / 200 mm Cooling water: Description / Pressure (Kg/cm²) / Flow rate / Temp (°C) / Size Main unit / 4.9 / 19.5 / 20~25 / 3/4" Heat exchanger / 4.9 / 37.8 / 20~25 / 1 1/4" Cryo compressor / 4.9 / 13.5 / 20~25 / 1/2" System configuration: Processor module: Front door type: Cylinder swing Notch / Flat finder: Flat notch (5) Cassette trays Carousal Cassette indexer Wafer blade Hollow gripper arm Arm position sensor Orienter sensor I/F Monitor: Front (TFT & Lightpen) VME: Mobile control module Wheel module: Wheel: STD 25 H/sinks, 6", Si coated Heat sink: 0 Degree PFS: PFS Type (Standard) PFS Power supply: Advance Scan system: Standard type Spin system: DD Motor & motec Tilt angle: 0~7 Degree PFS Gas panel: Ar Bleed box HYT Sensor Ferro seal flow meter Source / Terminal module: Ion source: Bernas Type no ovens No vaporizer Filament P.S Arc P.S Extraction P.S Max. extraction voltage: 220 keV Extraction suppression P.S: HITEK Series 1000 Source magnet: Extended AMU P.S Post acceleration P.S Maximum post voltage: 160 kV Extraction electrode: Dual bellows MRS MRS Chamber exhaust Facility module: DI Water resistance control Heat exchanger system: Internal Facility entry direction: Bottom entry Gas box module: Gas box type: (4) Gas modules Purge module: High pressure (Ar) Gas module 1: HP (BF3) Gas module 2: SDS (SiF4) Gas module 3: SDS Gas module 4: SDS (AsH3) Vacuum system: LEYBOLD TMP-11000C Source turbo pump LEYBOLD TMP-11000C Source turbo controller LEYBOLD TMP-301 MRS Turbo pump LEYBOLD MRS Turbo controller (2) CTI Torr-10 Onboard Wheel chamber cryo pumps (2) CTI 9600 Cryo compressors EBARA A07V-B Beamline dry pump EBARA 40x20 Processor dry pump Safety options: (2) Gas box exhaust flow switches (3) Ground lances Others: Enclosures Drawings / Manuals SECS Function Light tower: (3) Colors Cryo pump removal rails Control module Control module monitor: CRT No alignment tools DI Water digital indication Mains matching transformer: STD Type (STL) Isolation transformer: STD Type (STL) Operation language: English Input power: 208 VAC, 3 Phase+N, 50/60 Hz Maximum control power: 85 kVA Circuit breaker: 400A 1996 vintage.
  • AMAT / APPLIED MATERIALS: 9210

    APPLIED MATERIALS 9210 High current ion implanter, 8" Dual loadlock In-vac robot Hardware configuration: Processor module Beamline module Terminal module Power and control module Cryo compressor Beamline enclosure Wafer loader enclosure Electrodes MRS Tube Scum box Control module Wheel CGA 330 Gas bottle Wafer handler Cryo pump rack & heat exchanger Pumps: (2) CTI Cryopumps Diffusion pump LEYBOLD Turbovac 316C EDWARDS Dry pumps Energy : Extraction: 20 kV Acceleration: 160 kV (Max. beam energy 180 keV) Beam current: 100 µA - 20 mA (depends on species, energy) Tilt capabilty: 10° Wheel chamber: (17) Heatsinks for 200mm wafers Source type: Bernas (2) Vaporizers Gas system: External Ar (2) High pressure gas modules.
  • AMAT / APPLIED MATERIALS: XR80

    APPLIED MATERIALS xR80 Implanter, 8" P/N: 0240-94906 CIM Process: Low energy implanter System: HIMP-A04 Main system: xR-Leap SMIF system: LPT 2200 Cooling system: Heat exchanger / Closed loop de-ionized water cooling system Wafer loader: (3) Carousel paddle Wafer orients: Batch notch orient Wheel chamber: (17) Heat sinks, 8" Control system: Fiber optic communication network Control module: VME microprocessor Plasma flood gun: HDPFS Beam line: IHC Gas panel option: SDS AsH3 and BF3 Tilt: Variable implant angle, +/-10 degrees Hard disk: 4 GB RAM: 128 MB 1996 vintage.
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