Sputtering Systems

MRC 603 Sputtering system Parts system No cathodes or targets.

AIRCO TEMESCAL HRS 2550 Sputtering system 3 RF targets Auto / manual valving Direct drive mechanical pump Diffusion pump CV 14, 14 kW E-beam power supply Upgrade to CTI 10 Cryopump head with compressor available at additional cost.

AIRCO TEMESCAL VES 2550 Thin Film E-Beam Evaporation System 6 Pocket Turret E Beam Ion Gun Inficon XTC/2 Deposition Controller Ion Tech Gun MPS-3000 FC Controller CTI 10 Cryo Pump with Compressor Power Supply Edwards 80 Roughing Pump Hemispheric substrate holder and accessories.

AIRCO TEMESCAL BJD-1800 Sputter system (3) Cathodes: (2) Cathodes are configured for RF magnetron co-sputtering One cathode is configured for DC magnetron sputtering Load lock consists: Gate valve Adapter flange Motorized linear motion assembly 18” Diameter stainless steel process chamber Lower source tray swings out for maintenance Rotating substrate table: 7.5” Diameter 300-Watt RF biasing capability Rotate from 5 rpm to 100 rpm Process chamber is fully shielded and the shielding is flame sprayed Process chamber is pumped with ALCATEL 5900 Turbo molecular pump (880 l/s) Servo motor controlled throttle valve (3) Angstrom Sciences 2” diameter magnetron cathodes Cathode can be adjusted for angle and distance from substrate Independent shutter system ADVANCED ENERGY MDX 1kW DC Sputtering power supply (2) ADVANCED ENERGY 600 Watt RF generators Automatic impedance matching networks for magnetron cathode sputtering ADVANCED ENERGY 300 Watt RF generator Automatic impedance matching networks for biasing the substrate (3) MFC (mass flow control) Process gas plumbing is UHP stainless steel VCR Fittings throughout Electro-polished Orbit-ally welded Fully leak tested 1 Torr full-scale capacitance manometer Automatic isolation valve to prevent venting of manometer LEYBOLD D-30 20.9 CFM mechanical pump System base pressure: Better then 1 x10-7 torr Documentation.

AIRCO TEMESCAL BJD-1800 Sputter system (3) Cathodes: (2) Cathodes are configured for RF magnetron co-sputtering One cathode is configured for DC magnetron sputtering Load lock consists: Gate valve Adapter flange Motorized linear motion assembly 18” Diameter stainless steel process chamber Lower source tray swings out for maintenance Rotating substrate table: 7.5” Diameter 300-Watt RF biasing capability Rotate from 5 rpm to 100 rpm Process chamber is fully shielded and the shielding is flame sprayed Process chamber is pumped with ALCATEL 5900 Turbo molecular pump (880 l/s) Servo motor controlled throttle valve (3) Angstrom Sciences 2” diameter magnetron cathodes Cathode can be adjusted for angle and distance from substrate Independent shutter system ADVANCED ENERGY MDX 1kW DC Sputtering power supply (2) ADVANCED ENERGY 600 Watt RF generators Automatic impedance matching networks for magnetron cathode sputtering ADVANCED ENERGY 300 Watt RF generator Automatic impedance matching networks for biasing the substrate (3) MFC (mass flow control) Process gas plumbing is UHP stainless steel VCR Fittings throughout Electro-polished Orbit-ally welded Fully leak tested 1 Torr full-scale capacitance manometer Automatic isolation valve to prevent venting of manometer LEYBOLD D-30 20.9 CFM mechanical pump System base pressure: Better then 1 x10-7 torr Documentation.

AIRCO TEMESCAL FC 1800 E-beam evaporator Current setup is for multiple 3" and 4" (capable of 5" and 8") Cryopump (4) pockets A gate to isolate the wafer chamber when loading and unloading Multiwafer for 3" and 4", may be single wafer for 12" Rotatable wafer fixture Deposition monitor Automatic and manual control Can be inspected System was operational before shutdown.

AIRCO TEMESCAL VES 2550 Thin Film E-Beam Evaporation System 6 Pocket Turret E Beam Ion Gun Inficon XTC/2 Deposition Controller Ion Tech Gun MPS-3000 FC Controller CTI 10 Cryo Pump with Compressor Power Supply Edwards 80 Roughing Pump Hemispheric substrate holder and accessories.

AIRCO TEMESCAL BJD-1800 Sputter system (3) Cathodes: (2) Cathodes: Configured for RF magnetron co-sputtering Cathode: Configured for DC magnetron sputtering Load lock consists: Gate valve Adapter flange Motorized linear motion assembly Diameter stainless steel process chamber, 18” Lower source tray swings out for maintenance Rotating substrate table: Diameter: 7.5” RF Biasing capability: 300-Watt Rotate: 5 rpm-100 rpm Process chamber: Fully shielded and shielding is flame sprayed Pumped with ALCATEL 5900 Turbo molecular pump (880 l/s) Servo motor controlled throttle valve (3) ANGSTROM SCIENCES 2” Diameter magnetron cathodes Cathode can be adjusted for angle and distance from substrate Independent shutter system ADVANCED ENERGY MDX 1kW DC Sputtering power supply (2) ADVANCED ENERGY 600 Watt RF Generators Automatic impedance matching networks for magnetron cathode sputtering ADVANCED ENERGY 300 Watt RF Generator Automatic impedance matching networks for biasing substrate (3) MFC (Mass flow control) Process gas plumbing: UHP Stainless steel VCR Fittings throughout Electro-polished Orbitally welded Fully leak tested 1 Torr full-scale capacitance manometer Automatic isolation valve to prevent venting of manometer LEYBOLD D-30 20.9 CFM mechanical pump System base pressure: Better than 1x10-7 torr Materials: Ti, Cr, W, Ge, Si, Fe, MoS2, ITO, Ag, Nb, Cu, SiN, TiN, Al Documentation 2009 vintage.

AIRCO TEMESCAL BJD-1800 Sputter system (3) Cathodes: (2) Cathodes: Configured for RF magnetron co-sputtering Cathode: Configured for DC magnetron sputtering Load lock consists: Gate valve Adapter flange Motorized linear motion assembly Diameter stainless steel process chamber, 18” Lower source tray swings out for maintenance Rotating substrate table: Diameter: 7.5” RF Biasing capability: 300-Watt Rotate: 5 rpm-100 rpm Process chamber: Fully shielded and shielding is flame sprayed Pumped with ALCATEL 5900 Turbo molecular pump (880 l/s) Servo motor controlled throttle valve (3) ANGSTROM SCIENCES 2” Diameter magnetron cathodes Cathode can be adjusted for angle and distance from substrate Independent shutter system ADVANCED ENERGY MDX 1kW DC Sputtering power supply (2) ADVANCED ENERGY 600 Watt RF Generators Automatic impedance matching networks for magnetron cathode sputtering ADVANCED ENERGY 300 Watt RF Generator Automatic impedance matching networks for biasing substrate (3) MFC (Mass flow control) Process gas plumbing: UHP Stainless steel VCR Fittings throughout Electro-polished Orbitally welded Fully leak tested 1 Torr full-scale capacitance manometer Automatic isolation valve to prevent venting of manometer LEYBOLD D-30 20.9 CFM mechanical pump System base pressure: Better than 1x10-7 torr Materials: Ti, Cr, W, Ge, Si, Fe, MoS2, ITO, Ag, Nb, Cu, SiN, TiN, Al Documentation 2009 vintage.

AIRCO TEMESCAL HRS 2550 Sputtering system 3 RF targets Auto / manual valving Direct drive mechanical pump Diffusion pump CV 14, 14 kW E-beam power supply Upgrade to CTI 10 Cryopump head with compressor available at additional cost.

AIRCO TEMESCAL HRS 2550 Sputtering system 3 RF targets Auto / manual valving Direct drive mechanical pump Diffusion pump CV 14, 14 kW E-beam power supply Upgrade to CTI 10 Cryopump head with compressor available at additional cost.

AIRCO TEMESCAL BJD-1800 Sputter system (3) Cathodes: (2) Cathodes: Configured for RF magnetron co-sputtering Cathode: Configured for DC magnetron sputtering Load lock consists: Gate valve Adapter flange Motorized linear motion assembly Diameter stainless steel process chamber, 18” Lower source tray swings out for maintenance Rotating substrate table: Diameter: 7.5” RF Biasing capability: 300-Watt Rotate: 5 rpm-100 rpm Process chamber: Fully shielded and shielding is flame sprayed Pumped with ALCATEL 5900 Turbo molecular pump (880 l/s) Servo motor controlled throttle valve (3) ANGSTROM SCIENCES 2” Diameter magnetron cathodes Cathode can be adjusted for angle and distance from substrate Independent shutter system ADVANCED ENERGY MDX 1kW DC Sputtering power supply (2) ADVANCED ENERGY 600 Watt RF Generators Automatic impedance matching networks for magnetron cathode sputtering ADVANCED ENERGY 300 Watt RF Generator Automatic impedance matching networks for biasing substrate (3) MFC (Mass flow control) Process gas plumbing: UHP Stainless steel VCR Fittings throughout Electro-polished Orbitally welded Fully leak tested 1 Torr full-scale capacitance manometer Automatic isolation valve to prevent venting of manometer LEYBOLD D-30 20.9 CFM mechanical pump System base pressure: Better than 1x10-7 torr Materials: Ti, Cr, W, Ge, Si, Fe, MoS2, ITO, Ag, Nb, Cu, SiN, TiN, Al Documentation 2009 vintage.

AJA ATC-B-3400-H Sputtering and evaporation system.

AJA Orion 5 UHV Sputter coater Currently configured for manual operation, fully automatic capable Substrate bias and rotation (3) independent sputter guns (2) DC power supplies, 500W (1) RF power supply, 300W Substrate Size: < 5.75" diameter (sputter-up) with z-axis shift (2") Rotation to 20 rpm Heating up to 800ºC with RF bias capability to 50 W RF Sputter Guns: (3) 2" O.D. Targets. with integrated shutters for RF or DC (metallics/dielectrics) sputtering Confocal, sputter-up arrangement Capable of being upgraded to (5) cathodes Power Supplies: (2) Advanced Energy 500 W DC supplies 1300 W Seren RF generator with manual impedance match and selector switch Substrate Heating: PID temperature controller: programmable (2) 1000 W quartz lamps for heating inside water-cooled reflector box Vacuum Generation: Pfeiffer 500 L/sec turbo pump with magnetic bearing on vac side and ceramic bearing on motor side Backed by Adixen ACP15 dry rotary lobe pump: oil-free deposition system Sputtered: metals and metal oxides: copper, precious metals, nickel, iron, vanadium, molybdenum, aluminum, alumina, carbon / graphite Currently deinstalled and stored in a cleanroom ~2006 vintage.

AJA 2200 Sputtering system.

AJA ATC Orion 5 UHV Sputter coater Currently configured for manual operation, fully automatic capable Substrate bias and rotation (3) Independent sputter guns (2) DC Power supplies, 500W RF Power supply, 300W Substrate size: < 5.75" diameter (sputter-up) with z-axis shift (2") Rotation to 20 rpm Heating up to 800ºC with RF bias capability to 50 W RF Sputter guns: (3) 2" O.D. Targets With integrated shutters for RF or DC (metallics/dielectrics) sputtering Confocal, sputter-up arrangement Capable of being upgraded to (5) cathodes Power supplies: (2) ADVANCED ENERGY 500 W DC supplies 1300 W Seren RF generator with manual impedance match and selector switch Substrate heating: PID Temperature programmable controller (2) 1000 W Quartz lamps for heating inside water-cooled reflector box Vacuum generation: PFEIFFER 500 L/sec turbo pump With magnetic bearing on vac side and ceramic bearing on motor side Backed by ADIXEN ACP15 dry rotary lobe pump: Oil-free deposition system Sputtered: metals and metal oxides: Copper Precious metals Nickel Iron Vanadium Molybdenum Aluminum Alumina Carbon / Graphite Currently de-installed and stored in a cleanroom 2006 vintage.

AJA Orion 5 UHV AJA Orion 5 UHV Sputter coater Currently configured for manual operation, fully automatic capable Substrate bias and rotation (3) independent sputter guns (2) DC power supplies, 500W (1) RF power supply, 300W Substrate Size: < 5.75" diameter (sputter-up) with z-axis shift (2") Rotation to 20 rpm Heating up to 800ºC with RF bias capability to 50 W RF Sputter Guns: (3) 2" O.D. Targets. with integrated shutters for RF or DC (metallic /dielectrics) sputtering Confocal, sputter-up arrangement Capable of being upgraded to (5) cathodes Power Supplies: (2) Advanced Energy 500 W DC supplies 1300 W Seren RF generator with manual impedance match and selector switch Substrate Heating: PID temperature controller: programmable (2) 1000 W quartz lamps for heating inside water-cooled reflector box Vacuum Generation: Pfeiffer 500 L/sec turbo pump with magnetic bearing on vac side and ceramic bearing on motor side Backed by Adixen ACP15 dry rotary lobe pump: oil-free deposition system Sputtered: metals and metal oxides: copper, precious metals, nickel, iron, vanadium, molybdenum, aluminum, alumina, carbon / graphite Currently de-installed and stored in a cleanroom ~2006 vintage.

AJA ATC-B-3400-H Sputtering and evaporation system Target size: ~10.25" x ~5.25" Target backing: water cooled Water flowing path is machined inside the copper plate Process: only used Ar for sputtering (2) Gas channels (2) Mass flow controllers: calibrated for N2, 50 to 100 sccm MeiVac substrate heater, 6" (2) Original heater power supplies:(1) is nonfunctional Advanced Energy 2 kW water cooled RF generator with automatic matching network Roughing pump: nonfunctional Pulsed DC Power supply: capable of driving (2) guns simultaneously RF Power supply: capable of driving (1) gun (2) Sputtering guns: Magnetron type Not included: (2) Original substrate heaters Temperature controller.

AJA ATC Orion 5 UHV Sputter coater Currently configured for manual operation, fully automatic capable Substrate bias and rotation (3) Independent sputter guns (2) DC Power supplies, 500W RF Power supply, 300W Substrate size: < 5.75" diameter (sputter-up) with z-axis shift (2") Rotation to 20 rpm Heating up to 800ºC with RF bias capability to 50 W RF Sputter guns: (3) 2" O.D. Targets With integrated shutters for RF or DC (metallics/dielectrics) sputtering Confocal, sputter-up arrangement Capable of being upgraded to (5) cathodes Power supplies: (2) ADVANCED ENERGY 500 W DC supplies 1300 W Seren RF generator with manual impedance match and selector switch Substrate heating: PID Temperature programmable controller (2) 1000 W Quartz lamps for heating inside water-cooled reflector box Vacuum generation: PFEIFFER 500 L/sec turbo pump With magnetic bearing on vac side and ceramic bearing on motor side Backed by ADIXEN ACP15 dry rotary lobe pump: Oil-free deposition system Sputtered: metals and metal oxides: Copper Precious metals Nickel Iron Vanadium Molybdenum Aluminum Alumina Carbon / Graphite Currently de-installed and stored in a cleanroom 2006 vintage.

AJA ATC Orion 5 UHV Sputter coater Currently configured for manual operation, fully automatic capable Substrate bias and rotation (3) Independent sputter guns (2) DC Power supplies, 500W RF Power supply, 300W Substrate size: < 5.75" diameter (sputter-up) with z-axis shift (2") Rotation to 20 rpm Heating up to 800ºC with RF bias capability to 50 W RF Sputter guns: (3) 2" O.D. Targets With integrated shutters for RF or DC (metallics/dielectrics) sputtering Confocal, sputter-up arrangement Capable of being upgraded to (5) cathodes Power supplies: (2) ADVANCED ENERGY 500 W DC supplies 1300 W Seren RF generator with manual impedance match and selector switch Substrate heating: PID Temperature programmable controller (2) 1000 W Quartz lamps for heating inside water-cooled reflector box Vacuum generation: PFEIFFER 500 L/sec turbo pump With magnetic bearing on vac side and ceramic bearing on motor side Backed by ADIXEN ACP15 dry rotary lobe pump: Oil-free deposition system Sputtered: metals and metal oxides: Copper Precious metals Nickel Iron Vanadium Molybdenum Aluminum Alumina Carbon / Graphite Currently de-installed and stored in a cleanroom 2006 vintage.