Used SPEEDFAM 9B #192239 for sale

SPEEDFAM 9B is a precision wafer grinding, lapping, and polishing equipment used by the semiconductor industry for the production of silicon wafers. This system produces high-quality, low-defect silicon wafers for advanced applications such as high-speed photonics, quantum computing, and 5G communications. The FPS-SPEEDFAM 9 B unit is composed of several components including a mainframe, a grinding platform, and several wafer handling modules. The mainframe is made of durable aluminum alloy and is equipped with advanced safety features, a sophisticated control machine, and a c-axis for precise positioning. The grinding platform consists of a diamond-coated wheel, a vacuum tool to ensure quality material distribution and uniform polishing, and a motion-controlled X-Y table which allows for variable speeds and precise grinding. The wafer handling modules feature a multi-piece design that contains several different chambers, each with different levels of automation and capabilities. These parts include a wafer transfer and handling chamber, a wet polishing chamber, and a cleaning chamber for debris removal. 9B asset provides excellent grinding and polishing performance, eliminating the need for manual wafer processing tasks. The model utilizes several technologies such as chemical and abrasive polishing, dry-etching, and laser etching to create precise and high-quality surfaces without scratches or surface roughness. With its advanced control and motion features, the equipment is capable of grinding and polishing wafers with high aspect ratios and sharp edges at high speed and with high accuracy. Overall, 9 B is an excellent wafer grinding, lapping, and polishing system that is capable of producing high-quality silicon wafers for many advanced applications. The unit offers reliable, precise operation with advanced features and capabilities that make it one of the best wafer processing tools on the market today.