Used ESEC 3088iP for sale
![ESEC 3088iP ESEC 3088iP](https://cdn.caeonline.com/descriptions/images/bd6a050a-580f-4357-a50a-86a846bb61fd_esec_3088ip_345911.jpg)
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![ESEC 3088iP #9091779 ESEC 3088iP #9091779](https://cdn.caeonline.com/images/esec_3088ip_517881-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
62
![ESEC 3088iP #9091781 ESEC 3088iP #9091781](https://cdn.caeonline.com/images/esec_3088ip_517895-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
57
![ESEC 3088iP #9091782 ESEC 3088iP #9091782](https://cdn.caeonline.com/images/esec_3088ip_517903-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
56
![ESEC 3088iP #9091780 ESEC 3088iP #9091780](https://cdn.caeonline.com/images/esec_3088ip_517894-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
55
![ESEC 3088iP #9091777 ESEC 3088iP #9091777](https://cdn.caeonline.com/images/esec_3088ip_517842-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
54
![ESEC 3088iP #9091776 ESEC 3088iP #9091776](https://cdn.caeonline.com/images/esec_3088ip_517841-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
66
![ESEC 3088iP #9091763 ESEC 3088iP #9091763](https://cdn.caeonline.com/images/esec_3088ip_517771-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
80
![ESEC 3088iP #9091761 ESEC 3088iP #9091761](https://cdn.caeonline.com/images/esec_3088ip_517770-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
84
![ESEC 3088iP #9091758 ESEC 3088iP #9091758](https://cdn.caeonline.com/images/esec_3088ip_517764-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
56
![ESEC 3088iP #9091756 ESEC 3088iP #9091756](https://cdn.caeonline.com/images/esec_3088ip_517754-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
54
![ESEC 3088iP #9091754 ESEC 3088iP #9091754](https://cdn.caeonline.com/images/esec_3088ip_517749-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
61
![ESEC 3088iP #9091752 ESEC 3088iP #9091752](https://cdn.caeonline.com/images/esec_3088ip_517748-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
70
![ESEC 3088iP #9091751 ESEC 3088iP #9091751](https://cdn.caeonline.com/images/esec_3088ip_517747-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
66
![ESEC 3088iP #9091750 ESEC 3088iP #9091750](https://cdn.caeonline.com/images/esec_3088ip_517745-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
54
![ESEC 3088iP #9091748 ESEC 3088iP #9091748](https://cdn.caeonline.com/images/esec_3088ip_517744-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
80
![ESEC 3088iP #9091745 ESEC 3088iP #9091745](https://cdn.caeonline.com/images/esec_3088ip_517742-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
63
![ESEC 3088iP #9091743 ESEC 3088iP #9091743](https://cdn.caeonline.com/images/esec_3088ip_517726-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
57
![ESEC 3088iP #9091742 ESEC 3088iP #9091742](https://cdn.caeonline.com/images/esec_3088ip_517718-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
69
![ESEC 3088iP #9091740 ESEC 3088iP #9091740](https://cdn.caeonline.com/images/esec_3088ip_517716-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
71
![ESEC 3088iP #9091738 ESEC 3088iP #9091738](https://cdn.caeonline.com/images/esec_3088ip_517714-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
62
![ESEC 3088iP #9091734 ESEC 3088iP #9091734](https://cdn.caeonline.com/images/esec_3088ip_517704-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
61
![ESEC 3088iP #9091729 ESEC 3088iP #9091729](https://cdn.caeonline.com/images/esec_3088ip_517687-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
58
![ESEC 3088iP #9091727 ESEC 3088iP #9091727](https://cdn.caeonline.com/images/esec_3088ip_517679-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
70
![ESEC 3088iP #9091724 ESEC 3088iP #9091724](https://cdn.caeonline.com/images/esec_3088ip_517677-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
70
![ESEC 3088iP #9091720 ESEC 3088iP #9091720](https://cdn.caeonline.com/images/esec_3088ip_517674-prev.jpg)
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
56
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