Used AGILENT / HP / HEWLETT-PACKARD / KEYSIGHT 10342B #9237766 for sale

AGILENT / HP / HEWLETT-PACKARD / KEYSIGHT 10342B bonder is a precision manufacturing tool for making reliably strong and precise bonds in a variety of electronics components. HP 10342B is capable of performing a variety of wirebonding processes, including thermosonic, thermocompression, and Ultrasonic methods, at a speed of 10 to 20 bonds per second. It is compatible with gold, aluminum, and copper wires in the range of 32-75 microns in diameter. It also has a powerful vision system to ensure that all bonds are formed exactly as specified. For reliable and reproducible bonds, AGILENT 10342B features multiple user-settable parameters. These include wire feed rate, weld time, gap size, bond force, and alignment settings. This ensures that all bonds are the same length and strength and that the bond is not made too deep or too shallow. The wiring head of KEYSIGHT 10342B has excellent maneuverability and reaches up to 22mm away. It can access components in tight spots with extreme accuracy and minimal wear and tear on the components. It also ensures a uniform force across the entire width of the bond. HEWLETT-PACKARD 10342B is housed in a small, light-weight package for easy portability and a long life. It is equipped with a bright, backlit LCD display which allowsusers to monitor and adjust the temperature, pressure, and power settings. It also has a beep sound that indicates when the desired parameters are achieved. The machine is very user-friendly and features an intuitive, easy-to-follow graphical user interface that simplifies configuration and programming. 10342B is also easily upgradable, as it is compatible with various optional soldering packages, including AGILENT / HP / HEWLETT-PACKARD / KEYSIGHT 10342B HotBar Tools. HP 10342B offers exceptional performance, reliability, and longevity. With its precision manufacturing capabilities, built-in safety features, and versatile user interface, AGILENT 10342B is the perfect bonder for any electronics assembly facility.