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3334 RESULTS FOUND FOR: used Etchers / Ashers

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  • AMAT / APPLIED MATERIALS Centura 5200
  • AMAT / APPLIED MATERIALS Centura 5200 Super-E
  • AMAT / APPLIED MATERIALS Centura ACP

    AMAT / APPLIED MATERIALS: Centura ACP

    EPI Systems, 12" Load Port: TDK / Model TAS300 Type: G1 / 2EA Chamber: Selective Epi4EA Process: Selective Epi4EA Pressure: RP Lamp: 72 EA Rotation: 32 RPM MFC Spec: MFC 1: N2/H2 50 slm MFC 2: H210 slm MFC 3: HCL200 sccm MFC 4: HCL20 slm MFC 7: DCS300 sccm MFC 8: DCS1000 sccm Chamber: EBARA A70 WN Xfer & LL: EDWARDS iH600 Scrubber: EDWARDS Helios 2 Uptime: 96% 2007 vintage.
  • AMAT / APPLIED MATERIALS Centura AP DPS II

    AMAT / APPLIED MATERIALS: Centura AP DPS II

    Polysilicon etcher, 12" (4) Process chambers: DPS-ll With AGN ESC Missing parts: Qty / Name / Part number (1) / View window / 0200-36461 (1) / 10 Torr gauge / 135-00013 (1) / Ion gauge / 3310-0006 (1) / Bias match / 0190-03009 (1) / HV / 0090-00865 (1) / Foreline gauge /1350-01232 (1) / Ion gauge ISO valve / 3870-00021 (1) / Monochrometer EPD / 0010-05478 (1) / Slit door / 0020-64587 (1) / Slit door bellow / 0040-76767 (1) / NA Heated weldment TEE-KF 40 / 0190-23502 (1) / Heated weldment 7.09 KF 40 R / 0190-23503 (1) / MF Robot driver / 0190-17853 (3) / E84 Cables / - (2) / Special gas pipes / - 2006 vintage.
  • AMAT / APPLIED MATERIALS: Centura DPS

    Metal system, 8" 2007 vintage.
  • AMAT / APPLIED MATERIALS: Centura DPS

    Metal system, 8" Process: C2 Body, WBLL, HP+, 2x DPS R1, 2x ASP+, C/D, Orienter 2000 vintage.
  • AMAT / APPLIED MATERIALS: Centura DPS

    Metal etcher 1.55 (2) DPS / (2) ASP.
  • AMAT / APPLIED MATERIALS: Centura DPS II

    Metal etchers Model Channel A, B: DPS II Channel C, D: AXIOM Chamber A, B: Model: DPSII metal Bias generator: AE Apex 1513 13.56 MHz, maximum 1500 W Bias match: AE 13.56 MHz,3 kV navigation Source generator: AE APEX 3013 13.56 MHz, max 3000 W Source match: AE 13.56 MHz, 6 kV navigation Lid: Ceramic lid, single gas nozzle Turbo pump: STP-A2503PV Throttle valve: VAT Pendulum valve DN-250 ESC: Dual zone ceramic ESC Endpoint type: Monochromatic Cathode chiller: SMC POU Wall chiller: SMC INR-496-016C Process kit coating: Anodize coating Cooling: HT 200 / FC 40 Chamber C, D: Model: ASP Source generator: DAIHEN ATB-30B Source match: DAIHEN SMA -3001 Throttle valve: Throttling gate valve ESC: Pedestal heater VODM Mainframe configuration: IPUP Type: ALCATEL A100L Gas panel type: NextGen VHP Robot: Dual blade MF PC Type: CL7 Factory interface configuration: Frontend PC type: 4.0 FEPC FIC PC Type: CPCI (3) Load ports Atmospheric robot: YASKAWA Track robot Side storage: Right side MFC Configuration: EWE-02A Gas name Max flow MFC type Gas 1 BCL3 200 SC-24 Gas 2 NF3 100 SC-23 Gas 3 - - - Gas 4 CL2 400 SC-24 Gas 5 C2H4/HE 400 - Gas 6 SF6 200 SC-24 Gas 7 O2 100 AANGD40W1 Gas 8 CF4 100 AAPGD40W1 Gas 9 AR 400 SC-23 Gas 10 N2 50 SC-22 Gas 11 N2 300 SC-24 Gas 12 CHF3 50 SC-23 EWE-02B Gas Name Max flow MFC type Gas 1 BCL3 200 SC-24 Gas 2 NF3 100 SC-23 Gas 3 - - - Gas 4 CL2 400 SC-24 Gas 5 C2H4/HE 400 - Gas 6 SF6 200 SC-24 Gas 7 O2 1000 SC-25 Gas 8 CF4 100 SC-23 Gas 9 AR 400 SC-23 Gas 10 N2 50 SC-22 Gas 11 N2 300 SC-24 Gas 12 CHF3 50 SC-23 EWE-02C Gas Name Max flow MFC type Gas 7 O2 10000 SC-27 Gas 8 CF4 300 SC-24 Gas 9 - - - Gas 10 N2 1000 SC-25 EWE-02D Gas Name Max flow MFC type Gas 1 - - - Gas 2 - - - Gas 3 - - - Gas 4 - - - Gas 5 - - - Gas 6 - - - Gas 7 O2 10000 SC-27 Gas 8 CF4 300 SC-24 Gas 9 - - - Gas 10 N2 1000 SC-25.
  • AMAT / APPLIED MATERIALS Centura eMax
  • AMAT / APPLIED MATERIALS: Centura I P1

    WxZ system, 6" Chamber Type/ Location Position A WXZ Position B WXZ Position C WxP Position D WxP Position E MULTE COOLDOWN Position F ORIENTER Electrical Requirements Line Voltage 200/208 VAC Line Frequency 50~60 Hz System Safety Equipment EMO Guard Ring INCLUDED Water and Smoke Detector ALARM System Labels ENGLISH with Chinese simplified Wxz Chamber Options Bias Generator STANDARD ENI 12B3 Slit Valve Oring STANDARD Throttle Valve STANDARD THROTTLE Wxz Chamber Options Bias Generator STANDARD ENI 12B3 Slit Valve Oring STANDARD Throttle Valve STANDARD THROTTLE Wxz Chamber Options Bias Generator STANDARD ENI 12B3 Slit Valve Oring STANDARD Throttle Valve STANDARD THROTTLE Wxz Chamber Options Bias Generator STANDARD ENI 12B3 Slit Valve Oring STANDARD Throttle Valve STANDARD THROTTLE Orienter Chamber Options Chamber Type MULTE COOL DOWN Pallet Options General Mainframe Options Facilities Type REGULATED Facilities Orientation MAINFRAME FACILITIES BOTTOM CONNECTION Weight Dispersion Plates Mainframe And Remote Chamber Flow Switch Options Loadlock/Cassette Options Loadlock Type Narrow Body AUTO ROTATION Loadlock Platform UNIVERSAL Cassette Type Supported 200 mm Loadlock Cover Finish ANTI-STATIC PAINTED Loadlock Slit Valve Oring Type VITON Wafer Mapping ENHANCED Integrated Cassette Sensor YES Transfer Chamber Options Transfer Ch Manual Lid Hoist YES Robot Type HP Robot Blade Option ROUGHENED AL BLADE Wafer On Blade Detector BASIC Loadlock Vent BOTTOM VENT System Controller Controller Type Cntrlr Electrical Interface BOTTOM FEED Controller Exhaust TOP EXHAUST System Monitors System Monitor 1 STANDALONE Monitor Cursor BLINKING CURSOR AC Rack Controller Facility Interface REMOTE UPS INTERFACE ONLY
  • AMAT / APPLIED MATERIALS: Centura IPS

    Etchers, 8" (4) Chambers 2001 vintage.
  • AMAT / APPLIED MATERIALS 5200
  • AMAT / APPLIED MATERIALS: AME8111

    Plasma etch system 1987 vintage.
  • ALLWIN21: AW 901e

    Plasma etcher, 3"-6" Wafer loading: 3-Axis robot Stationary cassette plate Plasma power: RF 13.56 MHz Type: Parallel / Single wafer process Stand alone Gas lines: 1-3 Lines Throughput: 30-60 WPH, Process dependent Temperature: 6-65ºC (±2 ºC) Capability Gas lines: (4) Gas lines with MFCs Etcher rate: AW-901eR: 0-8000A / minute AW-903eR: 0-4000A / minute Process dependent Uniformity: Up to ±3%, Process dependent Particulate: <0.05 / cm2 Selectivity: 901eR: 2-20:1 AW-903eR: 2-20:1 Process dependent MTBF / MTTA / MTTR: 450 Hours / 100 Hours / 3.5 Hours Options: EOP Module with PCB GEM/SECS II Function Lamp tower alarm with buzzer Throttle valve pressure control Vacuum pump Chiller for chuck and chamber Through the wall Main frame, standard Pentium class PC with Keyboard Mouse USB SW Backup Cables Chuck:3"-6" Wafer aligner / Cooling station 3-Axis integrated solid robot: H-Zero (Standard) H1-7 x 10.5 (TTW) Fixed cassette station: Chuck assembly 901eR Non-anodized 903eR Anodized with flat 903eR Anodized with flat 903eR Non-anodized with flat Reactor Assembly: 901eR Non-anodized 903eR Anodized 903eR Non-anodized 903eR High performance Direct cooling Non direct cooling Pins: Quartz Ceramic SST Centering ring: Aluminum Ceramic Main control board: Gas box with (4) inline gas lines, MFC, filters, and pneumatic valves RF Matching network with PCB RF Generator: 13.56 MHz MKS Elite: 300 HD MKS Elite: 600 HD MKS Elite: 1000 HD ENI ACG 3 ENI ACG 10 AC / DC Box ATM Sensor UPC Pressure control 225 SCCM: 901eR 2000 SCCM: 903eR MKS Baratron with peumatic Iiolation valve Main vacuum valves Front EMO interlocks Touch screen GU, 15" AW-901eR AW-903eR Material etched Polysilicon / Nitride Oxide,SOG,Nitride Main etchant gases SG6, O2 / SF6,O2 CHF3,SF6,He Other gases CHCLF2 / None None Pressure (mTorr) 200-450 / 250-350 1600-3000 RF Power (Watts) 100-250 / 200-300 400-600 Temperature (C) 30 / 30 23 AC Power: AC Module: 200-240 VAC Selectable, 50/60 Hz, 3-wire single-phase Temperature controller: 200-240 VAC, 50/60 Hz, 3-wire single-phase Vacuum pump: 208-230 / 460 VAC, 60 Hz or 200-220 / 380 VAC, 50Hz, 3 Phase RF Generator: 200-240 VAC PC / Monitor: 115 VAC Cabinet exhaust: 100 cfm.
  • ALLWIN21: AW 903e

    TTW Plasma etcher, 3"-6" Wafer loading: 3-Axis robot Stationary cassette plate Plasma power: RF 13.56 MHz Type: Parallel / Single wafer process Through the wall (TTW) Gas lines: 1-3 Lines Throughput: 30-60 WPH, Process dependent Temperature: 6-65ºC (±2 ºC) Capability Gas lines: (4) Gas lines with MFCs Etcher rate: AW-901eR: 0-8000A / minute AW-903eR: 0-4000A / minute Process dependent Uniformity: Up to ±3%, Process dependent Particulate: <0.05 / cm2 Selectivity: 901eR: 2-20:1 AW-903eR: 2-20:1 Process dependent MTBF / MTTA / MTTR: 450 Hours / 100 Hours / 3.5 Hours Options: EOP Module with PCB GEM/SECS II Function Lamp tower alarm with buzzer Throttle valve pressure control Vacuum pump Chiller for chuck and chamber Through the wall Main frame, standard Pentium class PC with Keyboard Mouse USB SW Backup Cables Chuck:3"-6" Wafer aligner / Cooling station 3-Axis integrated solid robot: H-Zero (Standard) H1-7 x 10.5 (TTW) Fixed cassette station: Chuck assembly 901eR Non-anodized 903eR Anodized with flat 903eR Anodized with flat 903eR Non-anodized with flat Reactor Assembly: 901eR Non-anodized 903eR Anodized 903eR Non-anodized 903eR High performance Direct cooling Non direct cooling Pins: Quartz Ceramic SST Centering ring: Aluminum Ceramic Main control board: Gas box with (4) inline gas lines, MFC, filters, and pneumatic valves RF Matching network with PCB RF Generator: 13.56 MHz MKS Elite: 300 HD MKS Elite: 600 HD MKS Elite: 1000 HD ENI ACG 3 ENI ACG 10 AC / DC Box ATM Sensor UPC Pressure control 225 SCCM: 901eR 2000 SCCM: 903eR MKS Baratron with peumatic Iiolation valve Main vacuum valves Front EMO interlocks Touch screen GU, 15" AW-901eR AW-903eR Material Etched Polysilicon / Nitride Oxide,SOG,Nitride Main etchant gases SG6, O2 / SF6,O2 CHF3,SF6,He Other gases CHCLF2 / None None Pressure (mTorr) 200-450 / 250-350 1600-3000 RF Power (Watts) 100-250 / 200-300 400-600 Temperature (C) 30 / 30 23 AC Power: AC Module: 200-240 VAC Selectable, 50/60 Hz, 3-wire single-phase Temperature controller: 200-240 VAC, 50/60 Hz, 3-wire single-phase Vacuum pump: 208-230 / 460 VAC, 60 Hz or 200-220 / 380 VAC, 50Hz, 3 Phase RF Generator: 200-240 VAC PC / Monitor: 115 VAC Cabinet exhaust: 100 cfm.
  • AMAT / APPLIED MATERIALS: -

    MxP Etcher, 8" Chamber Clamp type for Centura frame.
  • AMAT / APPLIED MATERIALS P 5000 Mark II

    AMAT / APPLIED MATERIALS: P 5000 Mark II

    Etch / ASP system (2) Etch chambers (1) ASP chamber.
  • AMAT / APPLIED MATERIALS P5000

    AMAT / APPLIED MATERIALS: P5000

    Etch systems, 6" (Qty 3) ILD depostion and (Qty 1) W deposition There are 4 chambers in each tool Vacuum packaged and wooden crated since 2002 1992-1995 vintage.
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