Bonders

Wire bonders.

Bonder with vertical lead frame.

Wire bonders.

Wire bonder.

Wire bonder.

Wedge bonder.

Die bonder, 2013 vintage.

Die bonders Currently crated 2006 vintage.

Die bonders 2007 vintage.

Die bonder 2011 vintage.

Die bonders 2008 vintage.

Wire bonders with vertical LED Specifications: Bonding system: Bonding method: thermosonic (TS) BQM mode: constant current, voltage, power and normal (programmable) Loop type: normal, low, square, penta, J, VLED, FLEX XY resolution: 0.2µm Z resolution (capillary traveling motion): 0.4µm Fine pitch capability: 35µm pitch at 0.6 mil wire No. of bonding wires: up to 3000 Program storage: 1000 programs on hard disk Multimode transducer system: programmable profile, control and vibration modes Vision system: Pattern recognition time: 60 ms/point Pattern recognition accuracy: ± 0.37µm Lead locator detection: 12 ms/lead (3 leads/frame) Lead locator accuracy: ± 2.4 µm Post bond inspection: first bond, second bond and wire tracing Maximum die level different: 400 to 500µm Material handling system: Indexing speed: 200 to 250ms at 0.5" pitch Indexer resolution: 1µm Lead frame position accuracy: ± 2 mil Applicable lead frame: W: 24 to 73mm at bonding area in Y = 65mm 24 to 90mm at bonding area in Y = 48mm L: 280mm (magazine) T: 0.075 to 0.8mm Applicable magazine: W: 98mm (maximum) L: 140 to 280mm H: 180mm (magazine) Magazine pitch: 2.4 to 10mm (0.09" to 0.39") Device changeover: < 4 minutes Package changeover: < 5 minutes Number of buffer magazines: 3 (maximum 435mm) Does not include a Cu kit for Cu wire bonding 2002 to 2005 vintage.

Wire bonders, parts machines Currently stored in a temperature controlled storage.

Gold thermosonic bonders.

Wire bonder, 2010 vintage.

Bonders 2008 vintage.

Wire bonder.

Wire bonder 2006 vintage.

Dual head wire bonders 2006 vintage.

Stud bumping systems, 8"-12".