Used ALPHA HSB-300D-OP #293637235 for sale

ALPHA HSB-300D-OP is a Semi-Automatic Horizontal Wedge Bonding Machine that specializes in the production high quality hybrid integrated circuit (IC) packaging. It has been specifically designed to process IC packages quickly and accurately and to ensure that products are manufactured to the highest standards. HSB-300D-OP uses wedge-drive technology for precise wedge bond placement on both sides of the die, allowing for consistent contact angle accuracy. The high resolution stepper motor driven machine is designed to handle ultra-fine wire diameters, from 0.025 to 25 µm. ALPHA HSB-300D-OP also features an advanced CCD camera that inspects the die under test before and after wire bonding. This technology ensures product quality and reliability. The camera is also linked to a dedicated software package for easy and efficient product assembly. In addition, HSB-300D-OP supports full production data logging and traceability, enabling the user to monitor product yield and ensure quality assurance. ALPHA HSB-300D-OP is easy to operate and maintain, and requires minimal technical knowledge. It comes with a user-friendly touch screen interface, self-configuration and two-way password encryption. HSB-300D-OP is also maintained by qualified engineers. In terms of performance, ALPHA HSB-300D-OP is capable of achieving the highest bonding speeds (up to 8,000 wires per minute), while consistently maintaining the highest possible industry standards. Overall, HSB-300D-OP is an efficient and cost-effective solution for the production of high-quality hybrid integrated circuits. With its advanced technology and accurate wire bonding, ALPHA HSB-300D-OP ensures maximum product quality and reliability.