Used AMESS APT-1000 #9378905 for sale

AMESS APT-1000 is a microelectromechanical systems (MEMS) bonder which facilitates the bonding of MEMS microdevices. This device is able to perform micron-precision bonding with low thermal residual stress which enables efficient packaging of MEMS microdevices. It is suitable for MEMS packaging processes such as wafer-level bonding, flip-chip bonding, and die-attach bonding. APT-1000 features a temperature-controlled aluminum-decorated heater plate that is capable of rapidly heating up to 300 °C. An adjustable stage holds devices for bonding process. It also comes with an XYZ-axis stage that moves and magnifies objects to an accuracy of 0.2 μm to facilitate precise alignment of MEMS microdevices. Furthermore, it features a fine-pitch bonding head which can be easily manually adjusted to achieve the best working height, bond force, and spacing as required. AMESS APT-1000 is designed to be easy to use with a bright touchscreen display and intuitive human-machine interface (HMI). This bonder can be easily connected to an inert gas supply line for providing controlled bond pressure and process atmosphere. It offers a variety of operating modes to meet different bonding requirements. The temperature control of the device is accurate to within ±2°C and the bond gap is recorded in real-time to ensure uniformness across a batch of MEMS devices. This robust and reliable MEMS bonder is highly suitable for packaging MEMS microdevices in research, prototyping, and production environments. It is designed to be both reliable and cost-effective. With APT-1000, users are promised quality MEMS bonding process, repeatability, and excellent performance which help to ensure predictable results.