Used AMESS ASU-8000 #9352011 for sale

AMESS ASU-8000
Manufacturer
AMESS
Model
ASU-8000
ID: 9352011
Vintage: 2010
Bonder 2010 vintage.
AMESS ASU-8000 is a leading edge bonder designed to meet the demands of the wafer-level packaging technologies. The bonder features a specialized scanning mechanism for precise imaging of the wafer surface, enabling it to accurately detect a variety of defects. It is equipped with dual beam optics for precise control and alignment of the needle-tip for optimum bond formation. ASU-8000 supports a wide range of pad types, allowing it to accommodate a variety of technical requirements for semiconductor circuit bonding. AMESS ASU-8000 is also designed to provide extremely effective traceability of bond cycle data, ensuring high yields and quality. This data includes precise process management information, such as needle-to-pad size and gap size, as well as the actual parameters used for each step of the bonding operation. In addition, ASU-8000 is designed to handle large quantities of wafer accurately and efficiently. With its configurable bond-head assemblies, AMESS ASU-8000 can support multiple operators and multiple task sequences, allowing production line throughput to remain high despite fluctuating workloads. Furthermore, the system also supports a range of test cycles, such as interactive needle scans, for quality assurance purposes. ASU-8000 is capable of supporting up to 48 horizontal pads per wafer, making it ideal for wafer-level packaging projects where high pad density is critical. The bonder is also equipped with intuitive software, which permits complex cycle definitions to be modified quickly and easily. Furthermore, the software enables easy navigation of the system settings and parameters, helping users to ensure that the system is lightly enabled for optimal operation. Overall, AMESS ASU-8000 is a highly capable bonder designed to accurately and efficiently meet the requirements of advanced wafer-level packaging projects. Its intuitive software and configurable bond-head assemblies make it highly flexible, while its tracing capabilities allow users to precisely monitor and adjust the bonds. With its impressive feature list and reliability, ASU-8000 is an ideal choice for manufacturers seeking high performance bonders for their production lines.
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