Used AMICRA MICROTECHNOLOGIES / ASM AFC #293630169 for sale

ID: 293630169
Vintage: 2014
Die bonder 2014 vintage.
AMICRA MICROTECHNOLOGIES / ASM AFC is an advanced, highly accurate, and highly reliable semiconductor bonding machine specifically designed for high-volume and high-precision production. It's a fully automated machine that can bond wide variety of chip and package combinations. ASM AFC machine utilizes a sophisticated vision control equipment, advanced algorithms, and temperature control for optimized accuracy and efficiency. Its unique infeed system simplifies setup, allowing for faster processing of parts. Its state-of-the-art motion control unit ensures precise positioning of the bonds. The machine is capable of ULTRAPRECISE® FTB (Fine-pitch Three Bulk Bonding) and high-precision thermocompression bonding array, which enables the formation of extremely reliable and stable bonds on substrates and die. The bonder can be used for variety of materials including gold, silver, palladium, nickel, and copper. Unlike traditional systems, AMICRA MICROTECHNOLOGIES AFC machine utilizes a unique graphical user interface for quick and easy programming of the bonding process. Its automatic tool calibration maximizes component placement accuracy, allowing for faster throughput. Additionally, the machine features tool identification and traceability, along with a comprehensive parts tracking machine that provides detailed reports. This semi-automatic bonder also offers fabricating, assembling, and testing capabilities such as manual welding, manual soldering, and resistance testing. Its compact design allows it to sit comfortably in production cells. All of these capabilities make AFC bonder a valuable and cost-effective choice for advanced semiconductor production.
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