Used ASM 350 #293655390 for sale

ASM 350 is a high-performance bonder for large-scale production of optoelectronic and microelectronic devices. It is equipped with two independent, automatic stations and integrated with one rotating motor and one fully automated conveyor equipment. 350 is capable of placing down and bonding large die and die-attach packages, such as Flip Chip and Wire Bonds, at speeds of up to 40 parts per hour (pph). This ensures short cycle times and flexible production. The Bonder also has a integrated process-error detection system and an integrated vision unit. The bonder has an integrated vision machine that offers both automatic and manual fiducial, as well as automatic inspection for voids in the solder paste. The vision tool includes two digital cameras and an adapter that offers up to 50x magnification for detailed, high-resolution images for further inspection and analysis. The two cameras offer an x,y and theta adjustability, to adapt to varying package sizes, allowing for high accuracy in placement and bond site verification. The bonder is equipped with a pre-heat asset to ensure optimal heating at the bonding site and reduce thermal shock on device. The pre-heat range is programmable, allowing users to customize the settings according to their needs, helping to reduce voids and ensure quality. Furthermore, the pre-heat model can be used to keep components within a specific temperature range, to help ensure the reliability of packages. ASM 350 also has a peel test equipment, which helps to ensure bond integrity. The integrated conveyor system allows for automated control of the bonder, and fully automated production at high throughput rates, making 350 an ideal choice for medium- to high-volume production requirements. The robust bonder can be used for various applications, including Flip Chips and Wire Bonds, in laboratories as well as in final production. It is also capable of being integrated with other manufacturing systems to make a leaner manufacturing process. In summary, ASM 350 is a powerful and versatile bonder, capable of handling a wide range of die sizes, from small to large. It is equipped with two digital cameras and a pre-heat unit for optimal heating. Moreover, it has a built-in vision machine for automatic and manual fiducial, as well as automatic inspection for voids. Finally, the bonder can be integrated with other manufacturing systems, making it a great choice for both small-scale and large-scale production.