Used ASM 530 #293626956 for sale

ASM 530 is an advanced equipment for chip bonding technology that combines superior precision, accuracy and control. It is designed to enable users to produce high-performance chip-to-substrate bonds and enable consistent bond strength. 530 consists of a three-axis motor drive system, a fully adjustable programmable bondhead, a high-performance precision weighing unit and a range of advanced process control systems. The three-axis motor drive machine is finely tuned for high accuracy, noise-suppressed motion control and allows for precise positioning of the bondhead. The bondhead can be easily configured to perform a variety of bonding operations, including die attach and wire bonding. This allows for a wide range of process parameters to be controlled during the bonding operation. The high-performance precision weighing tool enables ASM 530 to accurately measure the weight of the bond before and after it is created. This provides the operator with a precise indication of how accurately the die or component has been attached. The asset also features a range of process control systems, including feedback control and automated tuning of the bond parameters, as well as an automatic stall detection model. 530 also offers a range of advanced monitoring systems including active thermal control to prevent overheating of the bond process, as well as a thermal compression equipment for the applied die force required. It also includes a range of advanced testing and validation tools, such as magnetic resonance imaging, x-ray fluorescence and system noise detection. Overall, ASM 530 is a highly advanced unit for chip bonding technology that offers superior control and accuracy for the production of high-performance chip-to-substrate bonds. With its advanced monitoring and control systems, users can achieve consistent bond strength and a wide range of process parameters can be controlled with the highest precision.