Used ASM 809C #9312395 for sale

ASM 809C is an advanced semi-automated Bonder designed for precision bonding applications in electronics, optoelectronics, photonics, data storage and creative product assembly. The Bonder is a cost-effective solution for medium-scale production with exceptional repeatability and high quality results. The Bonder is equipped with a two-stage heating system, a reliable quartz crystal and a digital bonding system for precise control over glue and adhesive materials. The glue is stored in a large, integrated heated glue storage tank, while the bonder is compatible with all types of single and dual sided adhesive materials requiring high temperatures. Additionally, the adjustable head of the Bonder ensures control over the height of the bonding head. 809C has an intuitive and easy to navigate menu system, which allows the user to quickly and easily access features such as application control, filter feedback, temperature regulation, and process diagnostics. The Bonder also has powerful low temperature bonding and programmable foil tension and loading capabilities, which can be set by the user to meet varying needs. The Bonder also offers a range of safety features, such as lock-out and key-out control, waveform monitoring and intruder detection. This includes an optional adjustable footswitch that can be used to start and stop bonding operations. For further peace of mind, ASM 809C is protected by a two-year warranty. In conclusion, 809C Bonder is a reliable and robust product that offers both accuracy and repeatability at a competitive cost. With a range of advanced features, all in a user-friendly package, the Bonder is an indispensable tool for any electronics industry.