Used ASM 809S #9312396 for sale

ASM 809S
Manufacturer
ASM
Model
809S
ID: 9312396
Vintage: 1995
Die bonder, 1995 vintage.
ASM 809S is a multi-purpose automatic wire bonder used for a variety of applications in the electronic and semiconductor industries. This equipment is used to form connections between an electronic device and its various components through a process known as wire bonding. 809S is equipped with an automated system which allows it to carry out the wire bonding process with instruction from the operator. ASM 809S comprises of several core components such as a pre-aligner, optical alignment device, wire feeder, bond head, power supply and gas control. The pre-aligner is used for initial alignment to ensure the accuracy of the bonding process. The optical alignment device provides close-up magnification of the entire chip structure and helps to ensure precise positioning of the bond. The wire feeder is used to deliver the wire to the bond head including various wire types ranging from standard copper to aluminum and gold. The bond head is responsible for manipulating the wire during the bonding process and also provides precise control of wire placement. The power supply provides electrical energy required to complete the process while the gas control monitors the environment in the bonding zone. 809S provides precise control over the wire bonding process. It allows for precise length control and precise bonding force. Its wire placement accuracy can reach up to 0.1 mm with the highest precise control over the wire path. Furthermore, the unit allows for easy bonding of a variety of wire types and thicknesses, ranging from .003 to .009. In addition, the programmable machine allows for easy setup of operation repeatability and precise process control. Moreover, users can adjust the working pressure, height, and speed of the bonder for further precision. Overall, ASM 809S is an essential tool for creating reliable and precise wire bonds. It has been designed to meet the demanding requirements of the semiconductor industry and its sophisticated software allows for easy modifications and adjustment. This automated tool provides consistent and repeatable wire bonds, making it an ideal tool for a wide range of industrial applications.
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