Used ASM AB 309 #159544 for sale

ASM AB 309 is a high-performance bonder for use in advanced semiconductor and flat panel display manufacturing processes. It provides precision and repeatability of process parameters, resulting in uniform bond results across a wide range of substrates. The primary benefit of AB 309 is its flexibility. It can be programmed to handle a variety of bond processes. This includes manual bonding, self-alignment, and automated processes. With the use of custom and supplier's proprietary recipes, this bonder can be fine-tuned for specific parameters for any single application. ASM AB 309 also offers precision and repeatability in bond settings. It is a dual-source bonder capable of delivering up to 793ºF (426ºC), depending on settings. This allows the bonder to very accurately bond to a variety of materials such as gold, solder, aluminum, copper, and lead. The preset parameters are also adjustable to account for individual applications. AB 309 also offers a uniform cinch bond, which is a combination of the conventional pre-assembly and welding bond. This bond is more uniform than those created using single-source bonders, resulting in improved adhesion between the two substrates. ASM AB 309 bonder has a robust design with a rugged body for use in a variety of industrial settings. Its base is made from a durable steel construction, allowing for greater stability when bonding at high temperatures. Its dual-axis bond force and pressure system further ensures improved accuracy and consistency of the bond parameters. AB 309 bonder is a reliable option for bonding in the electronics manufacturing industry. Its flexibility and accuracy make it an ideal choice for a variety of manufacturing processes. Its robust body provides durability and stability when bonding. Finally, its uniform cinch bond provides improved adhesion between materials.