Used ASM AB 309A #159846 for sale

ASM AB 309A is a semi-automated fixed-pressure thermosonic ball and wedge bonder. It is equipped with a "bonding head", or tooling assembly, that allows the device to form "thermosonic" (or thermally induced) bonds through the application of heat, pressure and ultrasonic energy. Generally, the bonding head consists of two parts that attach and mechanically clamp to the sample material. The "upper tool" and "lower tool", as they are known, contain electrical contacts for connecting and current-carrying wires and/or microelectronic parts. A furnace module generates the requisite heat and pressure needed to form the bond. AB 309A is a controllable bonder that allows for the dissolution and forming of bonds with an accuracy of less than one micron. This precision is established and sustained by the fixed-pressure configuration, where a constant and measured pressure is applied to the bonding materials in order to form the bond. Code-driven, programmable parameters can be set by a user with the touch of a keypad or remote switch, allowing the operator to control cycle time, wire tension, power level and other settings. This ability to set programmable parameters allows users to tailor the bonding process to the requirements of their particular application. ASM AB 309A includes detection systems to prevent tool damage and alert operators of any malfunctions in the bonding process. Users have full control over the entire bonding process, which begins with the insertion of a wire feeder, allowing the wire to be directly fed into the bonder. The feeder fits on both the upper and lower tool and is positioned to ensure that the wire is fed at the correct angle and tension. Ultrasonic energy is then applied to ensure that a consistent and reliable bond is formed. In summary, AB 309A is a semi-automated fixed-pressure thermosonic ball and wedge bonder. It is reputed to have a reliable accuracy of one micron, and the bonding process can be tailor-programmed to the requirements of the application. Its user-friendly interface allows for control of various parameters during the bond formation process. It is also equipped with a system of sensors and detectors to alert operators of any potential malfunctions or potential tool damage.