Used ASM AB 339 #9236025 for sale

ASM AB 339 is a fully automated bonder that is used for applications in the semiconductor industry. It is a full field wafer to wafer equipment that is designed for high accuracy, high productivity, and cost effectiveness. The system has a single lens design paired with a frame-capture unit that allows for advanced monitoring and alignment. ASM AB339 features an integrated wafer handling machine that is capable of moving and loading both front and rear-side wafers. This tool ensures accurate placement of wafers and eliminates potential misalignment. The automatically calibrated tooling asset also ensures that the correct pick-up position is reached, ensuring efficient bonding of wafers. AB 339 also utilizes an integrated imaging model based on CCD (Charge Coupled Device) technology. This imaging equipment is capable of providing high resolution images of wafers and features both automatic and manual controls. The imaging system includes automatic alignment and focus features, as well as manual control of focus on prealigned fiducials. In addition, AB339 utilizes a Temperature Controlled Wafer Holder to ensure precise temperature control in the bonder. This ensures that there is no thermal mismatch between the wafers being bonded and ensures accurate and repeatable bonding. This works in conjunction with an onboard temperature control unit to ensure temperature accuracy. ASM AB 339 features multiple onboard safety mechanisms to ensure that operations are completed safely. This includes Set Target Point and Spacer Height Sensor to prevent collision and overloads of wafers. Additionally, there is an accident detection machine to detect any potential dangers associated with the bonding process. Finally, ASM AB339 is designed to meet the most stringent industry standards for bonding and metrology. This tool is fully compliant with Class A/B/C of JEDEC standards and it features multiple automated quality control capabilities. This includes integrated non-contact metrology, automated programmable visual inspection, and automated counting of bond passes. All of these features allow for accurate and repeatable bonds and reduce tolerances for failure.