Used ASM AB 339 #9243813 for sale

Manufacturer
ASM
Model
AB 339
ID: 9243813
Vintage: 2000
Au wire bonder 2000 vintage.
ASM AB 339 is a fully automated thermocompression flip chip bonder designed for the assembly needs of high-volume applications. This advanced assembly equipment has the capability to process flip chip components with a width up to 2.5 mm and a height up to 22 mm. It is designed to work in line with a production line, which allows for maximal process efficiency and flexibility. The process platform used by ASM AB339 is based on a thermocompression bonding technology with advanced, high performance heater plates. The advanced control system of the bonder ensures perfect alignment and positioning of the components and guarantees a repeatable, precise and reliable bond. The intuitive and easy to use user interface of the unit enables easy setup of multiple jobs in a single run. The production speed of the bonder is up to 4,000 bonds per hour. AB 339 is designed to work in the toughest environmental conditions. It can work in temperatures ranging from -10°C to +55°C without any external cooling or heating systems. The machine frame is made of stainless steel that allows for clean room operation and is based on a highly rigid and vibration free construction that ensures high accuracy. The machine works with a wide range of wafer diameters from 200 to 381 mm, and is compatible with many different chip sizes and pad pitches. This innovative tool does not need any calibration for different parts, ensuring short machine setup times and highest efficiency. The automation of the asset allows for quick processes and accurate repeatability. AB339 also includes a number of safety features to protect operators and components against damage during the process. The model has intuitive sensors and switches, as well as multiple warning lights for operator safety and notification. For better component safety, the equipment also comes with a special heating system that is temperature controlled to avoid overheating or component damage. ASM AB 339 is a state of the art flip chip bonder capable of perfect precision and repeatability. Its advanced heating unit and intuitive user interface make this machine an ideal choice for high-volume assembly operations.
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