Used ASM AB 339 #9257895 for sale

ASM AB 339 is a bonder that is designed for use in the semiconductor industry. It is an adhesive based bonder that utilizes a combination of pressure and heat to provide highly reliable and permanent bonds quickly and efficiently. With its advanced features and design, ASM AB339 is suitable for a wide range of bonding applications, such as semiconductor chip bonding and assembly, semiconductor wafer bonding, and electronic packaging. AB 339 is equipped with advanced features to ensure a reliable and high-quality bond. It has a large bonding area of up to 300 mm that allows for larger surfaces to be quickly and efficiently bonded. In addition, AB339 has an automated wafer mapping program that allows it to precisely measure and map the wafer surface, providing accurate alignment and greatly reducing any potential errors during the bonding process. ASM AB 339 is also highly flexible, allowing for adjustable bond head temperature, pressure, and heating time. The pressure parameters can be adjusted for optimal bond quality. The accurate and precise temperature control ensures that a high-quality bond is maintained with minimal deformation of the bond structure. ASM AB339 is powered via a single power line, making it easy to install and maintain. Its intuitive user controls allow operators to quickly and easily adjust the settings, allowing for a more efficient and flexible bond process. Overall, AB 339 is a dependable and efficient bonder that can quickly and reliably create high-quality, permanent bonds. Its advanced features and design make it suitable for a wide range of applications, such as chip bonding, assembly and packaging, and wafer bonding. Its flexible design and user controls make it easy to install and operate, making it an ideal choice for any semiconductor bonding process.