Used ASM AB 339 #9257898 for sale

ASM AB 339 is an advanced automated stand-alone bonder for industrial microelectronic packaging applications. The product is designed for high speed and accuracy in bonding. The bonder is ideal for ultra-miniaturized packages, including high-density components, chip-scale packages, and other advanced micro electronic packages. ASM AB339 is a high precision package bonder manufactured with advanced microelectronics technology. The bonder is equipped with a patented micro adjustment device, allowing the user to fine-tune the alignment for exact package-to-package bond placement. The integrated single zone temperature controller ensures optimal temperatures for precision bonding, eliminating the risk of damaging sensitive components. AB 339 is designed to meet the most demanding packaging requirements. It features a robotic arm assembly that can position packages within nanometers of the target area. Thanks to the precision of the tool and its user-friendly software, the bonder can work with a wide range of materials, including copper, gold, and aluminum. AB339 is designed to work in standalone mode or as part of a fully automated assembly line. In either case, the compact size and low weight of the bonder make it easy to integrate into existing production systems. The redesigned power system can be modified quickly and easily to meet changing requirements. ASM AB 339 is fully compliant with industry standards and is backed by a rigorous product testing process. Other features include a self-calibration feature, a user-friendly touchscreen interface, and a built-in diagnostic system. Advanced security features (such as encrypted communications) also provide a high level of data protection. Overall, ASM AB339 is a powerful, advanced stand-alone bonder, ideal for applications in the ultra-miniaturized industrial microelectronic packaging industry. It combines robust construction and advanced technology to deliver a reliable and precise bonding process.