Used ASM AB 339 #9257899 for sale

ASM AB 339 is a high-performance bonder for automatic die-bonding applications. It is an ideal choice for high-volume semiconductor packaging and various other die-bonding applications. Designed for extreme accuracy at medium to high-speed applications, this bonder utilizes a high-performance laser equipment to create reliable and precise bonds. The bonder consists of two independent components: a digital imaging system and a fully integrated laser head. The digital imaging unit allows for precise die placement and alignment, while the laser head ensures precise and reliable bonding. The laser head includes an XY galvanometer scanning machine and a long-life laser diode, making it suitable for a wide range of repetitive bonding procedures. The main feature of ASM AB339 is its integrated laser head, which is designed to resist mechanical vibrations and prevent bond failure. The laser head utilizes the embedded laser head power stability and advanced thermal control technologies to ensure precise bonding and laser power stability over a wide range of temperatures. Furthermore, the bonder features a fiber coupled diode laser tool and an advanced scan head control asset that allows for accurate and reliable die-bonding. The bonder is controlled by a powerful and easy to use software, which incorporates an advanced imaging model and a two-dimensional die placement algorithm. This software ensures a high level of accuracy and repeatability of die placements. It also includes a profile parameter optimization algorithm that allows users to find the optimum parameter settings for each bond pattern. In addition, the bonder offers an extensive selection of die alignments, including vertical, lateral, camera alignment, and more. It also includes a range of pick and place algorithms to automatically locate and pick up dies. Furthermore, the bonder's integrated laser head provides users with the flexibility to customize their die bond patterns and parameters. Overall, AB 339 is a reliable and high-performance bonder for a wide range of die-bonding applications, such as semiconductor packaging. Its integrated laser head and advanced software allow users to bond with extreme precision and reliability. This bonder is simple to operate, and its optimized parameters and algorithms ensure a consistent and accurate die placement.