Used ASM AB 339 #9299638 for sale

ASM AB 339, manufactured by ASM International, is an automatic wafer bonding equipment designed to handle ultra-thin wafers and other fragile components. The system is capable of handling substrate wafers with a thickness of up to 400 µm and an area of up to 160 x 160 mm. It can be configured to accommodate up to four plasma or oxide bonding chambers, depending on the specific applications. ASM AB339 has an advanced user interface that provides users with a fluid, intuitive operation. Users can easily program, store, and recall process recipes. The unit also includes features such as an auto-calibration machine and process control software to improve yield rates and process precision. AB 339 is equipped with a motion tool that provides accurate and precise operation. The motion asset is configured with a robot arm for substrate handling and a wafer chuck for accurate wafer placement and alignment. The model also features an alignment equipment to ensure alignment accuracy and process repeatability. The system is built with a reliable bonded-wafer-release unit that helps increase manufacturing efficiency while greatly reducing contamination risks. The machine includes surface preparation vessels to provide the user with an efficient and safe way to perform post bond cleaning of bonded wafers. The tool is also configured with a particle contamination monitor to provide users with real-time feedback regarding particle content of the environment. This allows users to control the cleanliness of their work environment and improve yield rates. In addition, AB339 includes an inductively coupled plasma (ICP) asset that provides users with a higher level of process repeatability. The model includes a dual-frequency ICP equipment to ensure efficient and reliable bonding at different wafer thicknesses. ASM AB 339 is designed to provide users with a reliable, efficient, and accurate bonding process. The system is capable of operating in a variety of environments and capable of handling various types of substrates. Its advanced user interface allows users to easily program, store, and recall process recipes, while its motion unit provides users with accurate and precise operation. Lastly, its ICP systems provides users with a higher level of process repeatability while its particle contamination monitor ensures cleanliness and improved yield rates.