Used ASM AB 33928 #9195826 for sale

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ASM AB 33928
Sold
Manufacturer
ASM
Model
AB 33928
ID: 9195826
Wire bonder.
ASM AB 33928 is an advanced automated assembly bonder that is used for the precision bonding of die and leads in the electronics industry. It is well-suited for a variety of applications, such as wire bonding, die-attach, and ribbon bonding. AB 33928 offers essential features that make it an invaluable tool in the modern electronics manufacturing process. ASM AB 33928 is designed to be highly flexible and efficient. It has a maximum bonding rate of 1500 bonded elements per hour, with an accuracy of ±0.008 mm. It is equipped with a large 749x511 mm mounting plate, sufficiently large to accommodate a variety of component shapes and sizes. The bonder has an adjustable z-axis, allowing for precise focus alignment and precision micro-positioning. AB 33928 is designed to be user friendly, with a touch-screen control panel that allows access to a range of features and settings. The control panel includes a TCP/IP interface, which allows the bonder to be controlled from a remote computer station. Its intuitive, interactive interface allows for fast and easy setup and operation, making it suitable for both experienced and novice operators. The bonder also has a number of safety features, including an emergency stop button and a manual override. ASM AB 33928's advanced design ensures higher throughput rates and greater precision when compared to traditional manual bonding methods. Its high bond-to-bond repeatability ensures that bonds are consistently formed to spec, eliminating wastage and costly errors in the assembly process. The bonder is also equipped with an array of advanced features, including automatic grade recognition, built-in calibration, and low-temperature bonding capability. AB 33928 is a versatile, high-performance device specifically designed for efficient electronic assembly bonding. Its robust design, intuitive user interface, and comprehensive safety features make it a wise choice for any electronics manufacturing environment. The bonder is capable of reliably performing wire bonding, die-attach, ribbon bonding, and other precision assembly tasks with outstanding accuracy. Its large mounting plate, adjustable z-axis, and low-temperature capability make it an invaluable asset in the contemporary electronics industry.
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