Used ASM AB 339E #9255184 for sale

ASM AB 339E is an automatic bonder designed to streamline small, precise circuit board assembly. This machine provides an efficient and reliable way to apply delicate, low-profile solder connections. It is capable of bonding small sizes of 0.2 mm width, ranging up to 1.2 mm. ASM AB-339E is equipped with a customisable multi-zone database that allows settings to be stored for repeatable and accurate results on automated bond processes. It offers tight control on temperature and pressure profiles, allowing the user to control the bond parameters to a very high level of precision. A built-in user friendly touchscreen interface provides quick settings adjustments, and data logging provides a comprehensive quality control record of each batch. To create the professional, high-quality connection required for a robust, long-lasting assembly, AB 339E features an advanced IR preheat system. This is used to deliver precise temperature distribution across the board, without the risk of overheating sensitive components. It is also possible to set multiple heating profiles in a single process, simplifying the production run. The robust construction of the machine ensures accurate and consistent bond connections. External sensors provide feedback on the pressure and temperature of each feature. This allows for real-time monitoring, helping the machine to adjust parameters as required and guarantees quality connections. The bonded components are detected using a built-in, high-resolution endoscope system. This gives precise visual feedback on the exact location and alignment of the bonds. A single vision system also accesses information and settings from each zone so the user can be alerted when incorrect bonds are formed. AB-339E provides a reliable, affordable solution to automated circuit board assembly, ensuring quality and cost-effective production runs. It is capable of delivering professional, precise bonds, making it the ideal choice for all types of application.