Used ASM AB 350 #9392454 for sale

ASM AB 350 bonder is an automated bonder used in wafer-level packaging and MEMS applications. It is a computer-controlled equipment that is used to form rigid, hermetic seals between devices and their packages. AB 350 is designed to work with both lead- or medical-grade plastic packages, as well as metal packages with and without leads. It features a patented sealing chamber that provides a continuous and uniform lamination pressure for superior electrical and hermetic seals between the package and the substrate. The system has a modular design, allowing for easy upgrades and maintenance. ASM AB 350 features a patented dual-axis viscous z-rule to precisely control the pressure distribution across the package. This allows the bonder to control the lamination pressure applied to the device, ensuring uniform seals and preventing mechanical problems. The bonder is designed with a process chamber that provides multiple and rapid temperature changes, rapid and consistent laminate binder flow rate, pneumatic clamp positioning, and a temperature control unit for maintaining consistent temperature throughout the process. AB 350 also features a patented automated edge slitting process that separates laminated substrates to reduce the risk of voids and the formation of burrs. It is designed with an integrated vision machine that is used to ensure that packages are properly aligned before sealing. The bonder supports multiple materials and configurations for producing high-reliability packages. ASM AB 350 can be operated manual or automatic mode. It has the capability to produce a range of packages from the smallest basic device package to larger, more complex hermetic packages. AB 350 is a reliable, user-friendly and cost-effective packaging solution for a variety of applications. With its excellent performance and versatility, ASM AB 350 is an ideal choice for automated bonding and packaging of MEMS devices.