Used ASM AB 520 #293752945 for sale

ASM AB 520 is a fully automated bonder designed for fine-pitch and ultra-fine-pitch applications in the advanced electronics industry. Utilizing state-of-the-art physical vapor deposition (PVd) technology, AB 520 is a high-precision bonding equipment that is capable of forming reliable, repeatable micro-electromechanical system (MEMS) and other micro-welds. ASM AB 520 unit is also capable of dispensing small quantities of flux, powder and eutectic solder materials. AB 520 utilizes a direct-drive motor, which controls the speed and acceleration of the motor, resulting in accurate and repeatable bond formation. This motor is capable of producing higher deposition levels and higher-quality surface finishes. With the motor driven control, users can adjust the speed and the acceleration based on the material type and thickness of the substrate being bonded. In addition to its direct drive motor, ASM AB 520 also incorporates a dual-laser machine, which secures and aligns the substrate during bonding operations. The dual-laser tool is designed to help reduce the impact on the substrate from thermal loading and to help promote consistent bond formation. The bonding process on AB 520 is compliant with the J-STD-001 standard for soldering. The asset is also capable of producing consistent and repeatable bonding formations and achieves 97-99% bond formation. The adjustable pulse-width modulation, which controls the temperature and exposure time of the PVd process, allows users to vary the power of the intensity of the deposition and to adjust the bond time accordingly. ASM AB 520 is user-friendly and has a customizable control model that allows users to program process recipes for each job. In addition, the equipment can store up to eight different process recipes and allows users to select different process parameters for each job. AB 520 also features a robust automation system, which can be customized for a specific application. The unit also features an integrated vision machine, which is designed to help ensure process repeatability and accuracy. Overall, ASM AB 520 is a high-precision and reliable bonding tool that is designed to provide a consistent, repeatable bond formation on a variety of substrates. With its flexible and adjustable process parameters, customizable control asset and robust automation model, AB 520 is an ideal choice for high-precision bond formations in the advanced electronics industry.