Used ASM AB 520 #9377622 for sale

ASM AB 520 is a versatile and advanced medium- to high-volume microelectronic bonding equipment designed for attaching chips onto substrates or lead frames. It combines the power of a bonding head, thermocompression, ultrasonic, wedge, and thermocompression-localized high-frequency (TLHF) techniques to offer a reliable solution for joining components with maximum precision. The system is compatible with a variety of substrate materials and can accommodate different types of chips, making it particularly suitable for use in advanced electronic assemblies. It also offers programmed temperature and pressure control systems for accurate and controlled bonding. A key feature of the unit is its easy MicroStitch® programming language, which enables users to quickly create complex bond sequences and monitor functionality. This intuitive language allows data storage, execution creation, and the import/export of programs. Other programming options include automatic tracking of wedge bond parameters, automatic ball platform geometry adjustment, and microwave frequency power control. AB 520 machine is also equipped with advanced ESD and safety features, such as voltage control, signal quality control, X-Y-Z axes control, and automated temperature control. An integrated vision tool is capable of verifying bond quality and the logo mark on micro-positioning devices for fault tolerance. To enhance user convenience, the asset is compatible with various operating systems, such as Windows 7/8 and Windows 10. There are also options for connecting with a Remote Assistance Panel, a service that enables users to see and interact with the model via a web browser. Overall, ASM AB 520 equipment provides superior reliability and precision when bonding components. Its combination of advanced features and ease of use makes it an ideal choice for chip attachment in complex and intricate assemblies.